Patents by Inventor Arne DANNENBERG
Arne DANNENBERG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11608264Abstract: A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.Type: GrantFiled: December 15, 2017Date of Patent: March 21, 2023Assignee: ROBERT BOSCH GMBHInventors: Arne Dannenberg, Mike Schwarz, Thomas Friedrich
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Patent number: 11519803Abstract: A method for manufacturing a micromechanical sensor, in particular a pressure difference sensor, including creating a functional layer on a substrate; creating at least one rear side trench area proceeding from a rear side of a substrate, for exposing the functional layer for a sensor diaphragm; creating at least one front side trench area for forming at least one supporting structure, in particular an energy storage structure, preferably in the form of a spring structure, in the substrate as a mounting for the sensor diaphragm; and at least partially filling at least a front side trench area with a gel.Type: GrantFiled: June 14, 2018Date of Patent: December 6, 2022Assignee: Robert Bosch GmbHInventors: Arne Dannenberg, Stephan Oppl
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Patent number: 11441964Abstract: A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.Type: GrantFiled: October 26, 2018Date of Patent: September 13, 2022Assignee: Robert Bosch GmbHInventors: Volkmar Senz, Arne Dannenberg, Jochen Franz
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Patent number: 11326969Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.Type: GrantFiled: December 8, 2017Date of Patent: May 10, 2022Assignee: Robert Bosch GmbHInventors: Stefan Zehringer, Andreas Duell, Arne Dannenberg, Helmut Grutzeck, Jochen Franz, Mike Schwarz, Soeren Zimmermann, Stephan Oppl
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Publication number: 20220009769Abstract: The invention relates to a MEMS sensor, including a deflectably situated functional layer, a conversion device for converting a deflection of the functional layer into an electrical signal, the conversion device including at least one electrical element, the at least one electrical element being at least partially electrically connected to a first area, and the first area being at least partially electrically connected to a second area, and the first and second areas and/or the first area and the at least one electrical element being electrically operable in a reverse direction and a forward direction, and a control unit, the control unit being designed to at least partially operate the at least one electrical element and the first area and/or the first area and the second area in the forward direction to provide thermal energy.Type: ApplicationFiled: January 20, 2020Publication date: January 13, 2022Inventors: Arne Dannenberg, Mike Schwarz
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Patent number: 11208319Abstract: A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.Type: GrantFiled: February 13, 2018Date of Patent: December 28, 2021Assignee: Robert Bosch GmbHInventors: Arne Dannenberg, Joachim Fritz, Thomas Friedrich, Torsten Kramer
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Patent number: 11060937Abstract: A micromechanical pressure sensor, having—a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and—a pressure sensor frame; and—a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.Type: GrantFiled: February 21, 2018Date of Patent: July 13, 2021Assignee: Robert Bosch GmbHInventors: Ferenc Lukacs, Arne Dannenberg, Friedjof Heuck, Helmut Grutzeck, Mike Schwarz, Robert Maul, Tamas Dögei, Thomas Friedrich, Volkmar Senz
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Patent number: 11059717Abstract: A micromechanical pressure sensor, having a sensor core formed in a silicon substrate in a pressure-sensitive region, having a sensor membrane, a first cavity being formed in the silicon substrate on the sensor membrane; a second cavity formed between a rear-side surface of the silicon substrate and the sensor core, access holes that go out from the rear-side surface of the silicon substrate being connected to the second cavity; and at least one anchoring recess going out from the rear-side surface being formed in an anchoring region of the silicon substrate surrounding the pressure-sensitive region, the anchoring recess being formed such that a molding compound can flow into the anchoring recess.Type: GrantFiled: March 23, 2018Date of Patent: July 13, 2021Assignee: Robert Bosch GmbHInventors: Arne Dannenberg, Tobias Henn
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Publication number: 20210130168Abstract: A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.Type: ApplicationFiled: December 15, 2017Publication date: May 6, 2021Inventors: Arne Dannenberg, Mike Schwarz, Thomas Friedrich
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Patent number: 10988377Abstract: A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.Type: GrantFiled: September 18, 2017Date of Patent: April 27, 2021Assignee: Robert Bosch GmbHInventors: Arne Dannenberg, Torsten Kramer, Joachim Fritz, Thomas Friedrich
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Publication number: 20200326256Abstract: A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.Type: ApplicationFiled: October 26, 2018Publication date: October 15, 2020Inventors: Volkmar Senz, Arne Dannenberg, Jochen Franz
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Patent number: 10775253Abstract: A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.Type: GrantFiled: August 24, 2017Date of Patent: September 15, 2020Assignee: Robert Bosch GmbHInventors: Heiko Stahl, Arne Dannenberg, Daniel Haug, Daniel Kaercher, Michaela Mitschke, Mike Schwarz, Timo Lindemann
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Publication number: 20200225108Abstract: A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.Type: ApplicationFiled: August 24, 2017Publication date: July 16, 2020Applicant: Robert Bosch GmbHInventors: Heiko Stahl, Arne Dannenberg, Daniel Haug, Daniel Kaercher, Michaela Mitschke, Mike Schwarz, Timo Lindemann
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Publication number: 20200209089Abstract: A method for manufacturing a micromechanical sensor, in particular a pressure difference sensor, including creating a functional layer on a substrate; creating at least one rear side trench area proceeding from a rear side of a substrate, for exposing the functional layer for a sensor diaphragm; creating at least one front side trench area for forming at least one supporting structure, in particular an energy storage structure, preferably in the form of a spring structure, in the substrate as a mounting for the sensor diaphragm; and at least partially filling at least a front side trench area with a gel.Type: ApplicationFiled: June 14, 2018Publication date: July 2, 2020Inventors: Arne Dannenberg, Stephan Oppl
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Publication number: 20200088598Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm that spans the cavity; and a lever element that spans the diaphragm and has a first and a second end section, the end sections lying on opposite sides of a center section. A first joint element is fitted between the first end section and the substrate and a second joint element is fitted between the center section and the diaphragm, so that the lever element is able to be pivoted due to a deflection of the diaphragm. In addition, two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes of the sensors are disposed in such a way that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Moreover, the sensor includes an actuator for applying an actuating force between the lever element and the substrate.Type: ApplicationFiled: December 8, 2017Publication date: March 19, 2020Inventors: Stefan Zehringer, Andreas Duell, Arne Dannenberg, Helmut Grutzeck, Jochen Franz, Mike Schwarz, Soeren Zimmermann, Stephan Oppl
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Publication number: 20200024133Abstract: A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.Type: ApplicationFiled: February 13, 2018Publication date: January 23, 2020Inventors: Arne Dannenberg, Joachim Fritz, Thomas Friedrich, Torsten Kramer
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Publication number: 20200010317Abstract: A micromechanical pressure sensor, having a sensor core formed in a silicon substrate in a pressure-sensitive region, having a sensor membrane, a first cavity being formed in the silicon substrate on the sensor membrane; a second cavity formed between a rear-side surface of the silicon substrate and the sensor core, access holes that go out from the rear-side surface of the silicon substrate being connected to the second cavity; and at least one anchoring recess going out from the rear-side surface being formed in an anchoring region of the silicon substrate surrounding the pressure-sensitive region, the anchoring recess being formed such that a molding compound can flow into the anchoring recess.Type: ApplicationFiled: March 23, 2018Publication date: January 9, 2020Inventors: Arne Dannenberg, Tobias Henn
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Publication number: 20190376864Abstract: A micromechanical pressure sensor, having —a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and —a pressure sensor frame; and —a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.Type: ApplicationFiled: February 21, 2018Publication date: December 12, 2019Inventors: Ferenc Lukacs, Arne Dannenberg, Friedjof Heuck, Helmut Grutzeck, Mike Schwarz, Robert Maul, Tamas Dögei, Thomas Friedrich, Volkmar Senz
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Publication number: 20190202687Abstract: A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.Type: ApplicationFiled: September 18, 2017Publication date: July 4, 2019Inventors: Arne Dannenberg, Torsten Kramer, Joachim Fritz, Thomas Friedrich
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Patent number: 9927497Abstract: A sensor apparatus having at least one magnet core, on at least one carrier surface, which encompasses at least one soft magnetic material and for which a respective longitudinal center plane, which is oriented perpendicularly to the carrier surface and divides the respective magnet core into two halves having an identical mass, is definable, at least one coil being on, around, and/or adjacent to the at least one magnet core, the at least one magnet core having in its interior sub-regions by which an initiation of a magnetization reversal of the respective magnet core is targetedly locally controllable since a drive energy to be applied for propagation of a magnetic domain wall is elevated. Also described is a manufacturing method for a sensor apparatus having at least one magnet core, and a method for ascertaining a field strength of a magnetic field in at least one spatial direction.Type: GrantFiled: December 22, 2014Date of Patent: March 27, 2018Assignee: ROBERT BOSCH GMBHInventors: Frank Reichenbach, Sevki Gencol, Rainer Eckstein, Christian Patak, Achim Breitling, Arne Dannenberg, Frank Schatz