Abstract: The invention relates to an integrated circuit module (3) comprising a carrier substrate (4) with terminals for electrically contacting the carrier substrate (4) and a motherboard (2) and comprising at least one semiconductor chip (9) that is electrically contacted to the carrier substrate (4) and integrated into the substrate (4). The carrier substrate (4) comprises at least one cavity (8) that adjoins a mounting surface (10) for the motherboard (2) and holds at least one semiconductor chip (9). The cavity (8) is equipped with connection contacts (11a, 11b) for assigned connections of the semiconductor chip or chips (9), said contacts electrically contacting the semiconductor chip (9) and the carrier substrate (4). The carrier substrate (4) is multi-layered and comprises conductor tracks that extend transversally through several layers and the cavity (8) is hermetically sealed by a thermally conductive cover (12).

Abstract: The invention relates to an integrated circuit (1) having a plurality of substrate layers (2), active and/or passive components (3) embedded in the substrate layers (2), high-frequency lines conducted to the components (3) through the substrate layers (2), and cooling channels (6) for the dissipation of heat. The inventive circuit is characterized in that the cooling channels (6) are configured as high-frequency lines.

Abstract: A multichip circuit module includes a main board, at least one carrier substrate mounted on and in electrical contact with the main board, and at least one semiconductor chip arranged on the carrier substrate and in electrical contact therewith. The carrier substrate has at least one cavity on an assembly surface for receiving the semiconductor chip. The cavity includes connecting contacts which join with associated bumps on the semiconductor chip using a flip-chip technique. The assembly surface of the carrier substrate is placed on a contact surface of the main board, and a filling material is provided between the contract surface of the main board and the assembly surface of the carrier substrate.