Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.

Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer.

Abstract: An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit a radiation during operation of the component, and a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, and a difference in the refractive indices of the structured layer and the planarization layer is smaller than 0.3 at least in places.

Abstract: In various aspects, an optoelectronic device is provided. The device may include a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material, a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and at least one optoelectronic component, arranged between the first substrate and the second substrate, wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a first electrode layer, an organic light-emitting layer stack abutting the first electrode layer, a second electrode layer abutting the light-emitting layer stack and a multilayer encapsulation abutting the second electrode layer, wherein the multilayer encapsulation comprises a barrier layer and a planarization layer, wherein the planarization layer abuts the second electrode layer, and wherein the planarization layer is arranged between the second electrode layer and the barrier layer.

Abstract: A component module includes a component holder having a curved upper side, and a radiation-emitting component arranged in a curved shape on the upper side, wherein the component holder includes a heat-distributing region on the upper side, a neutral fiber running inside the component, an adhesive is planar and arranged between the radiation-emitting component and the upper side, and the adhesive fixes the radiation-emitting component on the upper side.

Abstract: In various embodiments, a method for producing an optoelectronic device is provided. The method may include in the following order: providing a substrate, having a first state having a non-planar shape, reshaping the substrate into a second state. The second state has a planar or substantially planar shape. The method may further include forming at least one optoelectronic component on the substrate and reshaping the substrate into a third state. The third state is identical or substantially identical to the first state.

Abstract: A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.

Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.

Abstract: The invention relates to an optoelectronic component, the optoelectronic component comprises a light-emitting layer stack, and an electrothermal protection element, which is connected to the layer stack in the component and has a temperature-dependent resistor.

Abstract: An organic light-emitting diode includes a carrier; at least two electrodes; an organic layer sequence having at least one active zone that generates light; and light-opaque visual protection layers that have no influence on an emission characteristic of the organic layer sequence and the organic light-emitting diode, one of which is located directly on the carrier, the organic layer sequence is located between the two electrodes and one of the electrodes is attached directly to the carrier, the visual protection layer, viewed in a plan view, completely surrounds the organic layer sequence, at least one of the electrodes is provided with a structuring in a region adjacent to the organic layer sequence in a plan view, in a plan view, the structuring is located completely beside the organic layer sequence, and the structuring is hidden by the visual protection layer for a viewer from outside the organic light-emitting diode.

Abstract: A method of preventing an analysis of the material composition of an organic optoelectronic component includes: A) providing an organic optoelectronic component having a functional component part and a camouflage layer, and B) determining an overall analysis spectrum of the organic optoelectronic component by IR or X-ray radiation, wherein the overall analysis spectrum is composed of a first analysis spectrum of the functional component part and a second analysis spectrum of the camouflage layer, and determination of the first and/or second analysis spectrum from the overall analysis spectrum is made more difficult or prevented so that, due to the camouflage layer, determination of the material composition of the functional component part is made difficult or prevented.

Abstract: An organic light-emitting device and a method for producing an organic light emitting device are disclosed. In an embodiment the device includes a substrate and at least one layer sequence arranged on the substrate and suitable for generating electromagnetic radiation. The at least one layer sequence includes at least one first electrode surface arranged on the substrate, at least one second electrode surface arranged on the first electrode surface and an organic functional layer stack having organic functional layers between the first electrode surface and the second electrode surface. The organic functional layer stack includes at least one organic light-emitting layer, wherein the at least one organic light-emitting layer is configured to emit light, wherein the organic functional layer stack includes at least one inhomogeneity layer, and wherein a thickness of the at least one inhomogeneity layer varies in a lateral direction.

Abstract: A light-emitting component and a method for producing a light-emitting component are disclosed. I an embodiment the light-emitting component includes a layer sequence for generating light, wherein the layer sequence comprises a marking, and wherein the marking is formed as a luminescence degradation of the layer sequence.

Abstract: A light-emitting component is provided including a functional layer stack having at least one light-emitting layer which is set up to generate light during the operation of the component, a first electrode and a second electrode, which are set up to inject charge carriers into the functional layer stack during operation, and an encapsulation arrangement having encapsulation material, which is arranged above at least one of the electrodes and the functional layer stack. At least one of the electrodes is transparent and contains a wavelength conversion substance and/or the encapsulation material is transparent and contains a wavelength conversion substance.

Abstract: The organic light-emitting diode (1) has a first electrode (21) with a first electric conductivity and a second electrode (22) with a second lower electric conductivity. An organic layer stack (4) for generating light is located between the electrodes (21, 22). The light-emitting diode (1) further comprises a current distribution layer (3) with a third high electric conductivity. When seen in a plan view, multiple contact regions (33) are located outside of an outer contour line (40) of the layer stack (4). The second electrode (22) and the current distribution layer (3) contact each other in the contact regions (33). In a current blocking region (34), the current distribution layer (3) is located entirely within the contour line (40) such that the second electrode (22) is electrically disconnected from the current distribution layer (3).

Abstract: An organic light-emitting component device comprising a first and second organic light-emitting component, a temperature detecting device configured for detecting at least one temperature, and a control unit coupled to the temperature detecting device and configured to operate the first and second component. The control unit is such that a first or second operating parameter of the first or second component, respectively, is changed, wherein the temperature detecting device comprises a first and second temperature detecting device. The first and second temperature detecting devices are designed for detecting a first and second temperature of the first and second component, respectively. The control unit is configured to change the first or second operating parameter depending on the difference between the first and second temperature, wherein the first or second operating parameter is changed such that the same temperature is established at the first and second component.

Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.

Abstract: An optoelectronic device includes a flexible organic light-emitting diode having a main extension plane, a first retaining element having a first major surface formed in accordance with a bent surface, and a second retaining element, wherein the OLED is arranged between the first retaining element and the second retaining element, and the OLED is mechanically fixed by the first retaining element and/or the second retaining element such that the main extension plane of the OLED is formed in accordance with the bent surface.

Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes an optically active layer structure on a surface of a planar substrate. The surface in a predefined region is free of optically active layer structure. The optoelectronic component further includes an encapsulation structure having an inorganic encapsulation layer. The inorganic encapsulation layer is formed on or above the optically active layer structure and the surface of the substrate in the predefined region. The inorganic encapsulation layer at least in the predefined region is formed in direct contact with the surface of the substrate. The surface of the substrate at least in the predefined region includes a structuring. The structuring is configured to increase the roughness of the surface. The substrate at least in the predefined region at the surface thereof includes or is formed from an inorganic material.