Abstract: A cooling container for liquid-cooled semiconductor construction elements wherein pegs are located in the interior of the container in the flow path of the cooling liquid and arranged vertically to the floors of the container and connected with these floors so that they are tight in regard to their material. Preferably, these pegs have a square cross-section and with one diagonal are located transversely to the flow direction. In addition, barriers are located at half the distance of flow in the cooling container, which are diametrically opposite for the purpose of narrowing the cross-section of the flow.

Abstract: A clamping device is disclosed for a thermally and electrically pressure-contacted semiconductor component in disk-cell construction which includes two pressure or conductor plates between which the semiconductor component is disposed. The two pressure or conductor plates are squeezed together by a clamping device which includes bolts and flat springs with an adjustable force measurable on the clamping device. The clamping bolts pass through a flat spring and the middle of the spring engages the center of a convex surface on one of the two pressure or conductor plates. A large-area clamping plate with a central threaded insert serves as the flat spring over at least the one pressure or conductor plate. The large-area clamping plate is capable of being stressed over a certain rotation angle proportioned to the force of a central clamping screw which presses on the convex surface. The large-area clamping plate is held by four clamping bolts which pass through the corners of the large-area clamping plate.