Patents by Inventor Arno Kriechbaum

Arno Kriechbaum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD
    Publication number: 20140307403
    Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
    Type: Application
    Filed: June 25, 2014
    Publication date: October 16, 2014
    Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
  • Method for integrating an electronic component into a printed circuit board
    Patent number: 8789271
    Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: July 29, 2014
    Assignee: AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
    Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
  • METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD
    Publication number: 20110069448
    Abstract: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
    Type: Application
    Filed: May 29, 2009
    Publication date: March 24, 2011
    Inventors: Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr, Fritz Haring, Gerhard Freydl, Andrea Koertvelyessy, Mark Beesley, Andreas Zluc, Wolfgang Schrittwieser
  • PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT
    Publication number: 20110051384
    Abstract: A printed circuit board element (1) comprising at least one component (2) embedded between a base (4) and a cover layer (6), which component (2) is adhered to the base (4) by means of an adhesive film section (3).
    Type: Application
    Filed: February 2, 2007
    Publication date: March 3, 2011
    Inventors: Arno Kriechbaum, Wolfgang Bauer, Johannes Stahr, Sabine Liebfahrt