Patents by Inventor Arnold B. Eastman, Jr.

Arnold B. Eastman, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for supplying slurry to a semiconductor processing machine
    Patent number: 6547646
    Abstract: A method for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, is disclosed. The method includes providing a supply of slurry and delivering slurry to the semiconductor processing machine. The supply typically provides slurry from a location remote from the semiconductor processing machine to a location proximate the semiconductor processing machine, where the slurry at the location proximate the semiconductor processing machine is unpressurized. A delivery subsystem typically agitates slurry in the basin by flowing the slurry through the basin, thereby inhibiting the settling of suspended particles in the slurry.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: April 15, 2003
    Assignee: Seh America, Inc.
    Inventors: Arnold B. Eastman, Jr., Michael W. Shepherd, Jack R. Wells
  • Apparatus for cleaning the grooves of lapping plates
    Patent number: 6258177
    Abstract: An apparatus and method for removing sedimentary waste from the grooves of a lapping machine is provided. A blade is inserted into a groove in a lapping plate, high pressure water is sprayed into the groove in the proximity of the blade, and the blade is drawn through the groove.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: July 10, 2001
    Assignee: SEH America
    Inventors: Arnold B. Eastman, Jr., Michael W. Shepherd
  • System and method for supplying slurry to a semiconductor processing machine
    Patent number: 6200202
    Abstract: A system for supplying a slurry of a liquid containing suspended particles to a semiconductor processing machine, where the slurry is used in processing semiconductor wafers, is disclosed. The system includes a supply of slurry and a delivery subsystem operatively associated with the supply of slurry, the delivery subsystem being configured to deliver slurry to the semiconductor processing machine. The supply typically is configured to provide slurry from a location remote from the semiconductor processing machine to a location proximate the semiconductor processing machine, where the slurry at the location proximate the semiconductor processing machine is unpressurized. The delivery subsystem typically is configured to agitate slurry in the basin by flowing the slurry through the basin, thereby inhibiting the settling of suspended particles in the slurry.
    Type: Grant
    Filed: November 30, 1998
    Date of Patent: March 13, 2001
    Assignee: SEH America, Inc.
    Inventors: Arnold B. Eastman, Jr., Michael W. Shepherd, Jack R. Wells