Patents by Inventor Arnold, Emil

Arnold, Emil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for making thin film silicon-on-insulator wafers employing wafer bonding and wafer thinning
    Patent number: 5213986
    Abstract: A very thin silicon film SOI device can be made utilizing a bond and etch-back process. In the presently claimed invention, boron dopant is introduced into a surface of a silicon device wafer and the doped surface is bonded onto another silicon wafer at an oxide surface. The device wafer is thinned by etching down to the doped region and, by subsequent annealing in hydrogen, boron is diffused out of the silicon surface layer to produce very thin SOI films.
    Type: Grant
    Filed: April 10, 1992
    Date of Patent: May 25, 1993
    Assignee: North American Philips Corporation
    Inventors: Ronald D. Pinker, Steven L. Merchant, Arnold, Emil