Abstract: A volumetric additive manufacturing (VAM) process for producing a solid object having a surface layer of a multifunctional material patterned thereon involves: contacting a surface of a solid base object with a liquid composition containing a photo-initiator and a multifunctional material covalently graftable to the surface of the solid base object; and, selectively irradiating the composition at the surface of the solid base object with patterned light, the irradiating being tomographic, to initiate covalent grafting of the multifunctional material to the surface of the solid base object to pattern only a portion of the surface of the solid base object with a layer of the multifunctional material grafted thereon, where the portion of the surface of the solid base object corresponds to the selectively irradiated surface of the solid base object.

Abstract: A photoresin composition for photopatterning in an oxygen-containing environment has a viscosity of about 300 cP or higher and contains: a reactive monomer with no hydrogen atoms having a bond-dissociation energy of less than about 410 kJ/mol, the hydrogen atoms; a non-amine reducing agent; and, a Norrish Type II photo-initiator. A volumetric additive manufacturing (VAM) process involves: immersing a solid base object in a liquid photoresin composition containing a photo-initiator and a multifunctional material; removing the solid base object with a film coating thereon from the liquid photoresin composition; and, selectively irradiating the composition at the surface of the object with patterned light to initiate covalent grafting or adhesion of the multifunctional material to the surface of the object to pattern only a portion of the surface of the object, where the portion of the surface of the object corresponds to the selectively irradiated surface of the object.

Abstract: The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.

Abstract: The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.