Abstract: A mechanism to transfer small flat workpieces (chips) between locations has a pair of interlinked four bar mechanisms one of which mechanisms carries a chip spreading means operated by two cams so that the chip pickup and release means moves in substantially vertical and horizontal timed relation to pickup a number of chips, move through a shallow horizontal arc, simultaneously spread the chips further apart, drop the chip; and repeat. Mechanism is disclosed for moving a plurality of chips of biaxially orientable polystyrene between a heating means and a forming means while laterally increasing the spacing between the chips.