Patents by Inventor Arnold Smith

Arnold Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12522064
    Abstract: A drive shaft assembly includes an outer shaft, an inner shaft, and an interface medium. The outer shaft defines a central channel. The inner shaft extends into the central channel and defines a clearance gap between an interior surface of the outer shaft and an exterior surface of the inner shaft. The interface medium is disposed in the clearance gap and rotationally couples the outer shaft and the inner shaft in an operational state of the drive shaft assembly. In response to a temperature of the drive shaft assembly exceeding a threshold temperature, the interface medium at least partially melts and rotationally uncouples the outer shaft and the inner shaft in a fault state of the drive shaft assembly.
    Type: Grant
    Filed: June 6, 2023
    Date of Patent: January 13, 2026
    Assignee: The Boeing Company
    Inventor: Arnold Smith
  • Publication number: 20240408961
    Abstract: A drive shaft assembly includes an outer shaft, an inner shaft, and an interface medium. The outer shaft defines a central channel. The inner shaft extends into the central channel and defines a clearance gap between an interior surface of the outer shaft and an exterior surface of the inner shaft. The interface medium is disposed in the clearance gap and rotationally couples the outer shaft and the inner shaft in an operational state of the drive shaft assembly. In response to a temperature of the drive shaft assembly exceeding a threshold temperature, the interface medium at least partially melts and rotationally uncouples the outer shaft and the inner shaft in a fault state of the drive shaft assembly.
    Type: Application
    Filed: June 6, 2023
    Publication date: December 12, 2024
    Applicant: The Boeing Company
    Inventor: Arnold Smith
  • Publication number: 20110290837
    Abstract: A rack lock safety mechanism for securely locking a weapon that includes a main frame, a safety-lock module coupled with the main frame, and a lock mechanism coupled with the main frame.
    Type: Application
    Filed: May 27, 2011
    Publication date: December 1, 2011
    Inventor: Arnold SMITH
  • Publication number: 20050249746
    Abstract: A P4 variant protein that has reduced enzymatic activity and that induces antibody to wild-type P4 protein and/or has good bactericidal activity against non-typable H. influenzae (NTHi) is useful as an active component in an immunogenic composition for humans. Methods of using these proteins, and compositions containing them in combination with additional antigens, are also provided.
    Type: Application
    Filed: March 13, 2003
    Publication date: November 10, 2005
    Inventors: Bruce Green, Gary Zlotnick, Leah Fletcher, Arnold Smith, Thomas Reilly
  • Publication number: 20050037972
    Abstract: Whole cell phage-display techniques were used to identify several peptides that bound preferentially to a non-typeable strain of Haemophilus influenzae. These peptides were able to inhibit growth of both H. influenzae and Staphylococcal aureus. Thus, methods for treating bacterial infections, alone or in combination with traditional antibiotics, are envisioned.
    Type: Application
    Filed: September 4, 2003
    Publication date: February 17, 2005
    Inventors: Sharon Bishop-Hurley, Francis Schmidt, Arnold Smith
  • Patent number: 5328079
    Abstract: Certain components of an integrated circuit package are disclosed herein including one or more dies, each of which has an array of die output/input bond pads, and die support means, for example a substrate or leadframe, which includes an array of electrically conductive leads. There is also disclosed herein a technique for wire bond connecting the bond pads of a particular die to either the bond pads of a second die or to the electrically conductive leads of the substrate or leadframe using a thermosonic or thermocompression ball bonding tool. In accordance with this technique, where at least one die is involved, connections are made to the bond pads of that die by means of stitch bonding in a way which does not damage the die.
    Type: Grant
    Filed: March 19, 1993
    Date of Patent: July 12, 1994
    Assignee: National Semiconductor Corporation
    Inventors: Ranjan J. Mathew, Arnold Smith, Luu T. Nguyen