Abstract: An independent leadframe transport system for use with an integrated-circuit processing unit. The independent leadframe transport system for use with an integrated-circuit processing unit, comprises; a main drive unit having at least one tool-drive, a stack unit coupled to the main drive unit, and a leadframe transport carousel coupled to the stack unit and positioned proximate to the at least one tool-drive. The stack unit is translationally coupled to the main drive unit so that the leadframe transport carousel may be selectively positioned within the at least one tool-drive in an in-tool position and without the at least one tool-drive in an out-tool position. The leadframe transport carousel has coupled thereto a plurality of leadframe for holding a leadframe from an on-load buffer, through the process area, to the off-load buffer.

Abstract: An independent leadframe transport system for use with an integrated-circuit processing unit. The independent leadframe transport system for use with an integrated-circuit processing unit, comprises; a main drive unit having at least one tool-drive, a stack unit coupled to the main drive unit, and a leadframe transport carousel coupled to the stack unit and positioned proximate to the at least one tool-drive. The stack unit is translationally coupled to the main drive unit so that the leadframe transport carousel may be selectively positioned within the at least one tool-drive in an in-tool position and without the at least one tool-drive in an out-tool position. The leadframe transport carousel has coupled thereto a plurality of leadframe handlers for holding a leadframe from an on-load buffer, through the process area, to the off-load buffer.

Abstract: A dual nested plunger transfer molding system. The dual nested plunger transfer molding system, comprises: a transfer plunger having a piston chamber internally, co-axially, positioned, integral within the transfer plunger; and a co-axial plunger slidably and co-axially coupled to the piston chamber. The co-axial plunger comprises: a co-axial plunger piston end, and a co-axial plunger drive end at the opposite end from the co-axial plunger piston end. The dual nested plunger transfer molding system further comprises a piston disc coupled to the co-axial plunger drive end, the piston disc cooperating with the piston chamber to form a slidable pressure boundary within the piston chamber.

Abstract: A tool drive apparatus and method are provided which are particularly well suited for the processing of semiconductor chips on leadframe strips. The tool drive apparatus includes at least one press having a tool-receiving space, a top and bottom tool received in the tool-receiving space, and a drive unit coupled to the at least one press for asynchronous substantially vertical movement of the top tools in adjacent presses. The drive unit includes a rotatable main shaft carrying up to six cam discs each of which may be associated with a press. This arrangement permits the processing of more than one process area on a leadframe strip in the same press cycle in one tool at a time enabling the tools to be placed closer together to shorten the processing line. The tool drive apparatus may also include a latch assembly which, when activated, creates a larger tool-receiving space for repair and maintenance of the tool in one press without affecting other presses in the processing line.

Abstract: An independent leadframe transport system for use with an integrated-circuit processing has a main drive unit having at least one tool-drive. A stack unit is moveably coupled to the main drive unit for storing unprocessed and processed leadframes. A leadframe transport carousel is coupled to the stack unit which loads an unprocessed leadframe from the stack unit and returns a processed leadframe back to the stack unit.

Abstract: A high-speed sluice assembly and method for transporting semiconductor devices includes a slide along which the semiconductor devices are transported and two independently controlled stoppers which control the transport of the semiconductor devices along the slide. Each of the independently controlled stoppers is connected to a separate actuator. Each of the actuators is also independently controlled. Several sensors are coupled to the slide to determine the position of the semiconductor devices as they are transported along the slide.

Abstract: Apparatus are shown for handling molded leadframes comprising, in combination, a gripper portion for grasping a molded leadframe from atop a first magazine holding a first plurality of molded leadframes and for releasing the molded leadframe when placed atop a second plurality of molded leadframes in a second magazine, and a mover portion coupled to the gripper portion for moving the gripper portion back and forth in a substantially semicircular motion between the first and second magazines. The mover portion includes a linking member coupled to the gripper portion, a first member rotatably coupled at a first end thereof to the linking member, a second member rotatably coupled at a first end thereof to the linking member, and a driver portion rotatably coupled to an opposite end of each of the first and second members for moving the gripper portion in a back and forth, substantially semicircular motion between the first and second magazines.