Patents by Inventor Arnold William Hogrefe, Jr.

Arnold William Hogrefe, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit for directly attaching to a glass substrate and method for manufacturing the same
    Patent number: 5705855
    Abstract: An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: January 6, 1998
    Assignee: Motorola, Inc.
    Inventors: Robert Thomas Carson, Lisa Reckleben, Dawn He Zhong, Arnold William Hogrefe, Jr., Scott Lawrence Joslin