Abstract: Multi-polygon, vertically-separated laser scanning apparatus and methods are disclosed. An example apparatus includes a multi-polygon. The multi-polygon includes a first polygon, a central axis, and a second polygon. The first polygon includes a first plurality of outwardly-facing mirrored facets. The second polygon includes a second plurality of outwardly-facing mirrored facets angularly offset about the central axis relative to the first plurality of outwardly-facing mirrored facets. The second polygon is positioned relative to the first polygon along the central axis. The first and second polygons are rotatable about the central axis.

Abstract: An optical system including multiple lenses to receive respective laser beams, and including a combiner (an optical device) to receive the laser beams from the multiple lenses and to combine the laser beams into a single beam. The optical assembly includes a micro-electro-mechanical system (MEMS) mirror to reflect the single beam from the combiner and provide a reflected beam as an exit beam through a window to an object. The optical assembly includes a single-pixel photodetector to collect light reflected from the object.

Abstract: Multi-polygon, vertically-separated laser scanning apparatus and methods are disclosed. An example apparatus includes a multi-polygon. The multi-polygon includes a first polygon, a central axis, and a second polygon. The first polygon includes a first plurality of outwardly-facing mirrored facets. The second polygon includes a second plurality of outwardly-facing mirrored facets angularly offset about the central axis relative to the first plurality of outwardly-facing mirrored facets. The second polygon is positioned relative to the first polygon along the central axis. The first and second polygons are rotatable about the central axis.

Abstract: An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an MEMS device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the MEMS device.

Abstract: A method and apparatus for dissipating an electrostatic charge from an optical element are described. An apparatus includes the optical element, a microelectromechanical system (MEMS) device located proximate to the optical element, and a conductive coating over the optical element, wherein the conductive coating is substantially transparent, and wherein the conductive coating dissipates the electrostatic charge.

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

Abstract: An apparatus for micro-electro-mechanical (MEMS) reinforcement is described herein. The apparatus includes a MEMS device and a stiffener. A micro scale mirror is to be embedded in a top layer of a substrate of the MEMS device. The stiffener is to be coupled to a back side of the MEMS device, wherein the stiffener is to stiffen the MEMS device via support of the MEMS device, without increasing a thickness of the MEMS device.

Abstract: An example apparatus for produce magnetic fields includes a base plate comprising a plurality of grooves. The apparatus includes an MEMS device disposed on the base plate. The apparatus further includes a number of magnets to produce one or more magnetic fields disposed on the plurality of grooves and adjacent to the MEMS device.

Abstract: An optical assembly including a polarizing beam splitter (PBS) to receive a laser beam from a light source. A micro-electro-mechanical systems (MEMS) mirror disposed in a support structure of the assembly, wherein the MEMS mirror is rotatable and is configured to receive the laser beam from the PBS and to reflect an exit beam. A phase retardation layer deposited on the MEMS mirror.

Abstract: Techniques for shielding an optical sensor are described. An example of an electronic device includes an optical sensor and a combined light-focusing and electrical-shielding unit disposed over the optical sensor. The light-focusing and electrical-shielding unit has two portions. The first portion gathers light and focuses the light on the electrical sensor. The second portion encloses sides of the first portion and is coated with an electrically conductive material to shield the optical sensor from electromagnetic interference.

Abstract: An optical system including multiple lenses to receive respective laser beams, and including a combiner (an optical device) to receive the laser beams from the multiple lenses and to combine the laser beams into a single beam. The optical assembly includes a micro-electro-mechanical system (MEMS) mirror to reflect the single beam from the combiner and provide a reflected beam as an exit beam through a window to an object. The optical assembly includes a single-pixel photodetector to collect light reflected from the object.

Abstract: Embodiments of the present disclosure are directed toward an apparatus with a rotatable MEMS device. The apparatus may include a magnetic circuit with two magnets disposed opposite each other to produce a magnetic field between the magnets. The MEMS device may be placed in a frame disposed between the magnets. The MEMS device may include a driving coil disposed around the device, and may be rotatable around a first axis of the frame, in response to application of electromagnetic force produced by interaction of electric current to pass through the driving coil, with the magnetic field. The frame may include another driving coil, and may be rotatable around a second axis orthogonal to first axis, in response to application of electromagnetic force produced by interaction of electric current to pass through the second driving coil, with the magnetic field. Other embodiments may be described and/or claimed.

Abstract: A method and apparatus for dissipating an electrostatic charge from an optical element are described. An apparatus includes the optical element, a microelectromechanical system (MEMS) device located proximate to the optical element, and a conductive coating over the optical element, wherein the conductive coating is substantially transparent, and wherein the conductive coating dissipates the electrostatic charge.

Abstract: An apparatus for mirco-electro-mechanical (MEMS) reinforcement is described herein. The apparatus includes a MEMS device and a stiffener. A micro scale mirror is to be embedded in a top layer of a substrate of the MEMS device. The stiffener is to be coupled to a back side of the MEMS device, wherein the stiffener is to stiffen the MEMS device via support of the MEMS device, without increasing a thickness of the MEMS device.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for a magnetic MEMS apparatus that in some instances may comprise a magnetic circuit and a MEMS device. The magnetic circuit may include two magnets that may be disposed on the substantially flat base and magnetized vertically to the base and in opposite directions to each other to produce a substantially horizontal magnetic field between the magnets. The MEMS device may comprise a mirror and a conductor to pass electric current to interact with the magnetic field created by the magnets. The MEMS device may be disposed substantially between the magnets of the magnetic circuit and above a plane formed by top surfaces of the magnets, to provide an unobstructed field of view for the mirror. The MEMS device may include a ferromagnetic layer to concentrate the magnetic field toward the conductor. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed toward an apparatus comprising a frameless MEMS device with a two-dimensional (2D) mirror, in accordance with some embodiments. The apparatus may include a base and a MEMS device disposed on the base. The MEMS device may comprise a rotor having a driving coil disposed around the rotor that is partially rotatable around a first axis, in response to interaction of a first magnetic field provided parallel to the first axis, with electric current to pass through the driving coil. The MEMS device may include a mirror disposed about a middle of the rotor. The mirror may be partially rotatable around a second axis coupled with the rotor and orthogonal to the first axis, in response to interaction of a second magnetic field provided parallel to the second axis, with electric current to pass through the coil. Other embodiments may be described and/or claimed.

Abstract: A mechanism and method for motion conversion is disclosed. This mechanism can be easily fabricated using standard bulk micromachining technology. Based on this method with appropriate design, a horizontal, in-plane motion can be converted to a vertical or angular displacement out-of-plane. This design has great advantages in micro devices, which are built from a single layer, i.e. wafer fabrication, where an in-plane force is easy to implement, such as by the use of comb drive mechanisms, but an out-of-plane motion may be hard to achieve. The mechanism comprises a pair of beams of different heights, rigidly connected together at a number of points along their length, such that application of an in-plane force to the double beam structure results in out-of-plane motion of the double beam structure at points distant from the point of application of the force.

Abstract: Embodiments of the present disclosure provide techniques and configurations for an optoelectronic assembly including a MEMS scanning mirror. In one embodiment, the MEMS scanning mirror may include a micro-scale mirror configured to be rotatable about a chord axis of the mirror to deflect an incident light beam into an exit window of the optoelectronic assembly, and a support structure configured to host the mirror to provide a light delivery field between a mirror surface and the exit window such that a path of the deflected light beam via the provided light delivery field to the exit window is un-obstructed. Other embodiments may be described and/or claimed.