Patents by Inventor Arnout Van den Bos
Arnout Van den Bos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10337938Abstract: A dual range sensor apparatus includes a single pressure transducer element coupled to respective inputs of two discrete signal conditioning modules, or to both inputs of a multiple input signal conditioning module that is configured to condition the output signal of two transducer elements. The disclosed sensor apparatus outputs a pressure signal in a limited pressure range with very high accuracy, and also provides a pressure signal in a wider pressure range with the same accuracy that can be achieved with traditional pressure sensor configurations. The sensor apparatus may provide output on a single output node in a multiplexed output signal format. The multiplexed output signal format may include several digital output formats and may be provided on a single output pin of the sensor apparatus.Type: GrantFiled: February 16, 2017Date of Patent: July 2, 2019Assignee: Sensata Technologies, Inc.Inventors: Erik Krommenhoek, Arnout van den Bos
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Publication number: 20180231429Abstract: A dual range sensor apparatus includes a single pressure transducer element coupled to respective inputs of two discrete signal conditioning modules, or to both inputs of a multiple input signal conditioning module that is configured to condition the output signal of two transducer elements. The disclosed sensor apparatus outputs a pressure signal in a limited pressure range with very high accuracy, and also provides a pressure signal in a wider pressure range with the same accuracy that can be achieved with traditional pressure sensor configurations. The sensor apparatus may provide output on a single output node in a multiplexed output signal format. The multiplexed output signal format may include several digital output formats and may be provided on a single output pin of the sensor apparatus.Type: ApplicationFiled: February 16, 2017Publication date: August 16, 2018Applicant: Sensata Technologies, Inc.Inventors: Erik Krommenhoek, Arnout van den Bos
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Patent number: 9027410Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: GrantFiled: September 14, 2012Date of Patent: May 12, 2015Assignee: Sensata Technologies, Inc.Inventors: Erik Hop, Gerard Klaasse, Rob Slakhorst, Wico Hopman, Arnout van den Bos
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Patent number: 8820170Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: GrantFiled: September 14, 2012Date of Patent: September 2, 2014Assignee: Sensata Technologies, Inc.Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
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Publication number: 20140076059Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: SENSATA TECHNOLOGIES, INC.Inventors: Erik Hop, Gerard Klaasse, Rob Slakhorst, Wico Hopman, Arnout van den Bos
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Publication number: 20140076057Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: SENSATA TECHNOLOGIES, INC.Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
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Publication number: 20050211915Abstract: The invention relates to a probe for a magnetic force microscope, comprising a movable cantilever placed in the plane of a wafer and a tip placed substantially at right angles to the cantilever, wherein the cantilever is able to move and its oscillation direction is in the wafer plane, and the tip lies virtually in or parallel to this wafer plane.Type: ApplicationFiled: December 18, 2002Publication date: September 29, 2005Applicant: Stichting voor de Technische WetenschappenInventors: Arnout Van den Bos, Leon Abelmann, Jacobus Lodder