Abstract: A diode pumped solid-state laser for high shock, high vibration environments such as those found in laser ignition systems for artillery systems.

Abstract: A laser diode array, having one or a plurality of electrically mounted laser diode bars, in which current paths through the array are sufficiently parallel and close together to result in a substantial reduction of inductance. As a result, higher duty cycles at lower pulse widths are possible. In some embodiments, a heatsink is provided as part of an overall assembly. The heatsink may provide part or all of a return portion of the current path for the array. Alternatively, the heatsink may be insulated from the rest of the array. The array itself may be fabricated in any of a number of known manners.

Abstract: A support structure for the mounting of laser diode arrays, to facilitate the pumping of a suitably-shaped lasing medium, is constituted by a non-planar, preferably generally annularly-shaped, thermally conductive portion having an outer surface and an inner surface, the inner surface being shaped to accommodate an appropriate number of laser diode arrays to pump the medium. The outer surface may have cooling fins provided on the outside to facilitate the removal of heat from the vicinity of the laser diode arrays. Axial or circumferential cooling passages may be provided to facilitate removal of heat from the vicinity of the lasing medium, as well as the arrays. The lasing medium also may be surrounded by a cooling tube through which coolant flows, to facilitate removal of heat from the vicinity of the lasing medium in particular.

Abstract: A lens support structure for supporting one or a plurality of optical elements, the structure including a base which may be a passive or an active optical element having one or more grooves formed therein. The structure is intended for use with a laser diode array, for collimating or focusing the emission of the laser diode bars in the array. To this end, the grooves in the base are formed precisely, in a predetermined relationship to the pitch of the grooves in the laser diode array, so that when the array and the lens support structure are matched, the light from the bars in the array reaches the optical elements disposed in the grooves in the lens support structure. The grooves may be formed along one axis, or along orthogonal axes. The optical elements in the grooves may be microlenses. Also, the base may have the grooves formed as slots extending completely through the base, support rails being formed unitarily with the base orthogonally to the slots.

Abstract: A lens support structure for supporting one or a plurality of optical elements, the structure including a base which may be a passive or an active optical element having one or more grooves formed therein. The structure is intended for use with a laser diode array, for collimating the emission of the laser diode bars in the array. To this end, the grooves in the base are formed precisely, to match the pitch of the grooves in the laser diode array, so that when the array and the lens support structure are matched, the light from the bars in the array reaches the optical elements disposed in the grooves in the lens support structure. The grooves may be formed along one axis, or along orthogonal axes. The optical elements in the grooves may be microlenses. Also, the base may have the grooves formed as slots extending completely through the base, support rails being formed unitarily with the base orthogonally to the slots.

Abstract: A laser diode array having a grooved substrate with one or more laser diode bars disposed in the substrate grooves. When mounted in the substrate, the bars emit light in a direction perpendicular to the minor surface of the substrate. Additional structure is provided to channel the light output of the array. The substrate may be comprised of a number of materials, including: ceramic; semiconductor; crystal, such as diamond; doped ceramic; doped semiconductor; doped crystal; composites, composed of conductive upper layers and nonconductive lower layers, or the like. In certain embodiments metallization is provided in the grooves for purposes of conduction and for attachment of the laser diode bars. In certain embodiments metallization may be provided in the grooves for purposes of attaching the laser diode bars securely; the conductive nature of the substrate providing the required electrical conductivity.

Abstract: Laser diode array fabrication is facilitated by provision of a monolithic substrate with one or more grooves of the same approximate depth and width as laser diodes secured therein. A metallization layer is provided in the grooves, and the laser diodes secured in the grooves thereafter. Depending on the size of the original substrate being used for the laser array mount, one or more submounts may be formed by cutting the substrate. Additionally, insertion of the laser diodes into the grooves may be facilitated by flexure of the substrate from the bottom, thus separating the groove walls at the top.

Abstract: A laser diode array in which a conductive layer is provided over a nonconductive or insulating layer, grooves being formed in the conductive layer, and laser diodes being disposed in the grooves. In one embodiment, the layers are separate; in another embodiment, the conductive and nonconductive layers are provided in the same monolithic substrate, which may be undoped semiconductor material such as silicon, with a highly doped upper portion in which the grooves are formed. In another embodiment of the array, the diodes are mounted in the grooves such that at least a portion of their light is emitted towards a bottom of the array.

Abstract: Laser diode array fabrication is facilitated by provision of a monolithic substrate with one or more grooves of the same approximate depth and width as laser diodes secured therein. A metallization layer is provided in the grooves, and the laser diodes secured in the grooves thereafter. Depending on the size of the original substrate being used for the laser array mount, one or more submounts may be formed by cutting the substrate. Additionally, insertion of the laser diodes into the grooves may be facilitated by flexure of the substrate from the bottom, thus separating the groove walls at the top.