Abstract: A method for attaching solder balls to solder pads on a circuit board, comprising distributing an approximately uniform flat layer of solder paste with distributed solder particles on top of a flat plate employing a squeegee, picking up the solder balls from a solder ball bin utilizing a vacuum tool, dipping the solder balls into the solder paste, lifting the solder balls out of the solder paste, placing the solder balls with the solder paste proximate to the center of the solder pad, releasing the solder balls, and reflowing assembly comprising the substrate, the solder balls, the solder paste, and solder particles in a reflow oven.

Abstract: Solder contacts can be formed on the conductive sites of a substrate by placing preformed solder balls on the conductive sites and then reflowing the solder balls to bond the solder balls to the conductive sites. After formation of the solder contacts, solder flux can be applied to at least a portion of the solder contacts. The solder contacts can then be reflowed to substantially improve the adhesion of the solder contacts to the conductive sites and increase the shear strength of the solder contacts.

Abstract: Solder contacts can be formed on the conductive sites of a substrate by placing preformed solder balls on the conductive sites and then reflowing the solder balls to bond the solder balls to the conductive sites. After formation of the solder contacts, solder flux can be applied to at least a portion of the solder contacts. The solder contacts can then be reflowed to substantially improve the adhesion of the solder contacts to the conductive sites and increase the shear strength of the solder contacts.