Abstract: Apparatus and method are disclosed for performing testing and fault isolation of high density passive boards and substrates. Using a small number of moving probes, simultaneous network resistance and network capacitance measurements may be performed. Thus, test time is minimized by eliminating the need for electrical switching and/or excessive probe movement during the test of a normal circuit board network. Simultaneous network capacitance and network leakage measurement are also achieved using phase-sensitive detection. Dual-frequency measurement techniques allow the measurement of both the capacitance value and resistance value of a leakage path between a network being measured and an unknown network. Any leakage resistance between a network under test and ground or power planes within the circuit board may also be determined from the measurements.

Abstract: Apparatus and method are disclosed for performing testing and fault isolation of high density passive boards (e.g. unpopulated circuit boards) and substrates. Using a small number of moving probes, simultaneous network resistance and network capacitance measurements may be performed. Thus, test time is minimized by eliminating the need for electrical switching and/or excessive probe movement during the test of a normal circuit board network. Simultaneous network capacitance and network leakage measurement are also achieved using phase-sensitive detection. Dual-frequency measurement techniques allow the measurement of both the capacitance value and resistance value of a leakage path between a network being measured and an unknown network. Any leakage resistance between a network under test and ground or power planes within the circuit board may also be determined from the measurements.

Abstract: In order to test conductors on substrates for current constricting defects, such as cracks, narrow conductors, line breaks and intermittent opens, a test signal combining two alternating current signals at different frequencies and direct current offset signal is applied to the conductor. Upon encountering a defect, intermodulation signals are generated and detected. The phase of the detected signal and the phase of a reference signal are compared. The difference between the phase of the two signals is indicative of the presence of a defect in the conductor. The invention has particular application for testing thin conductors.