Abstract: Fluid-based switches and a method for producing the same are disclosed. In one embodiment, a switch is provided with first and second mated substrates that define therebetween at least portions of a number of cavities. A plurality of wettable pads is exposed within one or more of the cavities. A switching fluid is held within one or more of the cavities, and is wetted to the wettable pads. The switching fluid serves to open and block light paths through one or more of the cavities, in response to forces that are applied to the switching fluid. Forces are applied to the switching fluid by an actuating fluid that is held within one or more of the cavities. At least a portion of the switching fluid is coated with a surface tension modifier.

Abstract: Fluid-based switches and a method for producing the same are disclosed. In one embodiment, a switch is provided with first and second mated substrates that define therebetween at least portions of a number of cavities. A plurality of wettable pads is exposed within one or more of the cavities. A switching fluid is held within one or more of the cavities, and is wetted to the wettable pads. The switching fluid serves to open and block light paths through one or more of the cavities, in response to forces that are applied to the switching fluid. Forces are applied to the switching fluid by an actuating fluid that is held within one or more of the cavities. At least a portion of the switching fluid is coated with a surface tension modifier.

Abstract: A semiconductor substrate is presented which is manufactured from hollow, gas-filled glass or ceramic microspheres, which are bound together in a dried or fired matrix. The microspheres may be glass-coated microspheres, which are bound together by sintering the outer layers of glass together. The semiconductor surface may be smoothed by glazing the surface.

Abstract: The present invention relates to an electrical relay in which a solid slug is moved within a channel and used to make or break an electrical connection. The solid slug is moved by electromagnets. In the preferred embodiment, the slug is wetted by a conducting liquid, such as liquid metal, that also adheres to wettable contact pads within the channel to provide a latching mechanism. The relay is amenable to manufacture by micro-machining techniques.

Abstract: An electrical relay that uses a conducting liquid in the switching mechanism. In the relay, a pair of fixed electrical contacts is held a small distance from a pair of moveable electrical contacts. The facing surfaces of the contacts each support a droplet of a conducting liquid, such as a liquid metal. A piezoelectric or magnetorestrictive actuator is energized to move the pair of moveable contacts, closing the gap between one of the fixed contacts and one of the moveable contacts, thereby causing conducting liquid droplets to coalesce and form an electrical circuit. At the same time, the gap between the other fixed contact and the other moveable contact is increased, thereby causing conducting liquid droplets to separate and break an electrical circuit. The actuator is then de-energized and the moveable electrical contacts return to their starting positions. The volume of liquid metal is chosen so that liquid metal droplets remain coalesced or separated because of surface tension in the liquid.

Abstract: An application specific heat sink assembly is presented wherein a heat-dissipating substrate is selected of a particular size, shape and material in order to meet predetermined heat-dissipating requirements and more than one heat-dissipating stud is selected or formed of particular sizes, shapes and materials in order to meet predetermined requirements. The heat-dissipating substrate and heat-dissipating studs form a heat sink assembly having application specific features selected to optimize the heat-dissipating, CTE matching, environmental resistance requirements, low mass requirements, size, machinability, cost structure and other desirable features of a particular application for dissipating heat from multiple electronic components.

Abstract: A method and structure for an optical switch. According to the structure of the present invention, a liquid-filled chamber is housed within a solid material. A plurality of seal belts within the liquid-filled chamber are coupled to the solid material, while a plurality of piezoelectric elements are coupled to a plurality of membranes. The plurality of membranes are coupled to the liquid-filled chamber, and a plurality of optical waveguides are coupled to the liquid-filled chamber. The plurality of seal belts are coupled to a plurality of liquid metal globules, wherein one or more of the plurality of liquid metal globules are coupled to a slug. According to the method, one or more piezoelectric elements are actuated, causing one or more corresponding membrane elements to be deflected.

Abstract: A method and structure for an optical switch. According to the structure and method of the present invention, a gas-filled chamber is housed within a solid material. A plurality of contacts within the gas-filled chamber are coupled to the solid material, while a plurality of piezoelectric elements within the gas-filled chamber are also coupled to the solid material. A slug within the gas-filled chamber is coupled to one or more of the plurality of contacts and further coupled to one or more of the plurality of piezoelectric elements. A liquid metal within the gas-filled chamber is coupled to the slug, and coupled to the plurality of contacts. The actuation of the one or more piezoelectric elements causes the slug to move from a first number of contacts to a second number of contacts wetted by the liquid metal.

Abstract: An application specific heat sink assembly for dissipating heat from one or more electronic components is presented with a heat-dissipating substrate selected for one or more of its size, shape, mass, cost, thermal conductivity, or environmental resistance properties; and one or more heat-dissipating studs. Each heat-dissipating stud may be attached to the heat-dissipating substrate such that an electronic component may be attached to each heat-dissipating stud with the heat-dissipating stud providing CTE transition between the heat-dissipating substrate and the electronic component to be cooled. At least one of the heat-dissipating studs may have an upper layer with a CTE similar to the electronic component's CTE and one or more intermediate layers between the upper layer and the heat-dissipating substrate to provide CTE stepping between the CTE of the heat-dissipating substrate and the CTE of the upper layer of the heat-dissipating stud.

Abstract: An application specific heat sink assembly is presented in which a heat-dissipating substrate is selected of a particular size, shape and material in order to meet predetermined heat-dissipating requirements and a heat-dissipating stud is selected or formed of a particular size, shape and material in order to meet predetermined requirements. The heat-dissipating substrate and heat-dissipating stud form a heat sink assembly having application specific features selected to optimize the heat-dissipating, CTE matching, environmental resistance requirements, low mass requirements, size, machinability, cost structure and other desirable features of a particular application for dissipating heat from an electronic component.

Abstract: Disclosed herein are methods for modifying an inner-layer circuit feature of a printed circuit board. A trimming point on the inner-layer circuit feature is identified using an x-ray inspection system. The coordinates of the trimming point are then related to the coordinates of a visible reference marker on the printed circuit board. Next, the relationship between the visible reference marker and the trimming point is used to position a cutting tool over the trimming point. Finally, the cutting tool is used to make one or more cuts into the printed circuit board, until the inner-layer circuit feature is acceptably modified at the trimming point.

Abstract: The present invention relates to an electrical relay in which a solid slug is moved within a channel and used to make or break an electrical connection. The solid slug is moved by electromagnets. In the preferred embodiment, the slug is wetted by a conducting liquid, such as liquid metal, that also adheres to wettable contact pads within the channel to provide a latching mechanism. The relay is amenable to manufacture by micro-machining techniques.

Abstract: A method and apparatus for multiplexing and demultiplexing optical signals. The apparatus includes first and second optical waveguides coupled via an optical coupler. The optical coupler has a coupling waveguide and an optical switching wedge attached to a piezoelectric actuator. In operation, first and second optical signals are received by the first and second optical waveguides, respectively. If the signals are to be combined, the optical switching wedge is moved to a first position where it is optically coupled to the first optical waveguide. The first optical signal is then transmitted, via the coupling waveguide, to the second optical waveguide, where it is combined with the second optical signal. If the signals are not to be combined, the optical switching wedge is moved to a second position where it is optically uncoupled from the first optical waveguide.

Abstract: A method and structure for an electrical switch. A gas-filled chamber is housed within a solid material. Contacts within the gas-filled chamber are coupled to the solid material, while a plurality of piezoelectric elements within the gas-filled chamber are also coupled to the solid material. A slug within the gas-filled chamber is coupled to one or more of the plurality of contacts and further coupled to one or more of the plurality of piezoelectric elements. A liquid metal within the gas-filled chamber is coupled to the slug, and coupled to the plurality of contacts. One or more of the piezoelectric elements are actuated, with the actuation of the one or more piezoelectric elements causing the slug coupled to the one or more piezoelectric elements to move from a first number of contacts to a second number of contacts wherein the first number of contacts and the second number of contacts are wetted by the liquid metal.

Abstract: A closed-loop piezoelectric pump is disclosed for use in a fluid delivery system. The pump housing includes a movable diaphragm that defines a pumping chamber within the pump housing, the pumping chamber having an inlet for admitting fluid and an outlet for emitting fluid. A piezoelectric transducer is coupled to the moveable diaphragm and operates to produce a pumping action by varying the volume of the pumping chamber. The piezoelectric transducer may be used to generate an acoustic pressure pulse within the fluid delivery system and to sense reflections of the acoustic pressure pulse caused by impedance changes downstream of the pump. Properties of the fluid path downstream of pump may be determined from the characteristics of the sensed reflections.

Abstract: A method and structure for an optical switch. According to the structure of the present invention, a gas-filled chamber is housed within a solid material. A plurality of contacts within the gas-filled chamber are coupled to the solid material, while a plurality of piezoelectric elements within the gas-filled chamber are also coupled to the solid material. A slug within the gas-filled chamber is coupled to one or more of the plurality of contacts and further coupled to one or more of the plurality of piezoelectric elements. A liquid metal within the gas-filled chamber is coupled to the slug, and coupled to the plurality of contacts.

Abstract: An electromagnetic optical relay is disclosed in which a solid slug moves within a switching channel formed in relay housing. An optical path passing through the switching channel is blocked or unblocked by motion of the solid slug. Motion of the solid slug is controlled by at least two electromagnetic actuators, such as electrical coils surround the switching channel. Motion of the solid slug is resisted by a liquid, such as a liquid metal, that wets between the solid slug and at least one fixed contact pad in the switching channel. The surface tension of the liquid provides a latching mechanism for the relay. An optical signal may be reflected from the wetted surface of the solid slug and switched to an alternative optical path.

Abstract: A piezoelectric optical relay array having one or more array elements. Each array element contains a transparent mirror housing, located at the intersection of two optical paths. A solid slug is moved within a channel passing through the transparent mirror housing by the action of piezoelectric elements. A surface of the solid slug is wetted by a liquid metal to form a reflective surface. The solid slug is moved in or out of the transparent mirror housing to select between the optical paths. When the solid slug is within the transparent mirror housing, an incoming optical signal is reflected from the reflective surface of the liquid metal. The liquid metal adheres to wettable metal surfaces within the channel to provide a latching mechanism.

Abstract: A piezoelectric relay is disclosed in which a solid slug moves within a switching channel formed in relay housing. An electrical circuit passing between fixed contact pads in the switching channel is completed or broken by motion of the solid slug. Motion of the solid slug is controlled by at least two piezoelectric actuators within the switching channel. Motion of the solid slug is resisted by an electrically conductive liquid, such as a liquid metal, that wets between the solid slug and the contact pad in the switching channel. The surface tension of the, liquid provides a latching mechanism for the relay.

Abstract: A method and structure for an optical switch. A channel is housed within a solid material. Contacts coupled to the channel are further coupled to the solid material, while a plurality of piezoelectric elements are coupled to chamber and further coupled to a slug. Optical waveguides are coupled to the channel. The contacts are coupled to a plurality of liquid metal globules, wherein one or more of the plurality of liquid metal globules are coupled to a slug. One or more piezoelectric elements are actuated, causing the slug to be moved within the channel. The motion of the slug is operable to block or unblock one or more of the plurality of optical waveguides.