Abstract: A silicon capacitive pressure sensor is disclosed having a silicon diaphragm and a silicon substrate arranged in parallel and separated by a glass dielectric spacer. The glass is deposited onto a surface of the substrate using an ion milling machine. The sensor further includes a transition piece attached to a second layer of glass insulator disposed between the silicon diaphragm and the transition piece. The transition piece has a throughbore formed therein for applying a fluid to a surface of the silicon diaphragm, the fluid having a pressure desired to be measured by the sensor. The glass disposed between the diaphragm and the transition piece is deposited onto the transition piece using the ion milling process.

Abstract: Manufacturing hinged diaphragms for semiconductor sensors (e.g., accelerometers, pressure transducers, etc.), from a SIMOX wafer (W, FIG. 3 A), in which the internal, insulating, silicon dioxide (SiO.sub.2) layer (3) is used as an etch stop in removing silicon from the underside of the wafer by etching with an appropriately selective etch, producing the reduced thickness, peripheral "hinge" areas (9; FIG. 3 A to FIG. 3 B), with the exposed part of the silicon dioxide layer being removed in a subsequent etching step (FIG. 3 B to FIG. 3C) using a different, selective etch. This produces a single layer, single-crystal, silicon "hinge" (9'; FIG. 3C) of uniform, continuous material, enhancing the linearity of diaphragm movement during use and the sensor's sensitivity and accuracy. (See FIG. 4 for methodological steps.

Abstract: A micromachined three-plate capacitive accelerometer incorporates hinges attached to top and bottom surfaces of the proof mass that are symmetric about X and Y axes and also about diagonal axes; passageways for gas film damping in the fixed members that do not affect the capacitance to any significant degree; and provision for independently selecting two of the parameters sensitivity, capacitance and maximum acceleration.

Abstract: A novel heterojunction acoustic charge transport device includes a transducer fabricated on a GaAs/AlGaAs heterojunction material that launches surface acoustic waver (SAW) along a transport channel. The device is characterized by a photodiode configured adjacent to the channel on the substrate to receive a modulated optical beam. An electrical signal equivalent is provided to a Schottky electrode at the end of the transport channel modulating the charge propagated by the surface acoustic wave. The modulated signal is output at a distal end of the transport channel.

Abstract: An electronic mixer is decribed which utilizes an optoelectronic switch formed from a semi-insulating substrate of indium phosphide doped with a deep level impurity and disposed intermediate a microstrip transmission line. One conductor of the transmission line has a small gap in its metallization. Upon illumination of the gap by laser pulses from a laser source which are absorbed near the semiconductor surface, a photo-generated electron-hole plasma forms thereby providing a conducting path across the gap. An RF signal to be mixed with a LO signal is coupled to one side of the switch. The LO signal controls the Laser source. The output of the switch is therefore the product of the RF and LO signal.