Patents by Inventor Arthur Gernt Bond, III

Arthur Gernt Bond, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors
    Patent number: 11613460
    Abstract: MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 28, 2023
    Assignees: EngeniusMicro, LLC, Auburn University
    Inventors: Brian A. English, Carl Rudd, Michael S. Kranz, Robert Neal Dean, Jr., Mark Lee Adams, Brent Douglas Bottenfield, Arthur Gernt Bond, III
  • Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors
    Patent number: 10988375
    Abstract: MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: April 27, 2021
    Assignee: ENGENIUSMICRO, LLC
    Inventors: Brian A. English, Carl Rudd, Michael S. Kranz, Robert Neal Dean, Jr., Mark Lee Adams, Brent Douglas Bottenfield, Arthur Gernt Bond, III