Patents by Inventor Arthur H. Good

Arthur H. Good has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7143511
    Abstract: A method for forming a heat pipe is provided comprising coating the interior surface of the vessel with a wicking material and partially saturating the wick with a working fluid. The vessel is then partially evacuated. A portion of the vessel is pinched-off so as to seal the vessel. Then, the pinched-off portion of the vessel is pressed so as to move it from a first position wherein the portion is convex to a second position wherein the portion is concave.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: December 5, 2006
    Assignee: Thermal Corp.
    Inventors: Matthew Connors, Arthur H. Good
  • Patent number: 7090002
    Abstract: A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein a portion of the wall is convex to a second position wherein the portion of the wall is concave. The convex wall may include at least one stress concentrator so that upon an application of a force to the convex wall, the stress concentrator causes the convex wall to buckle. A method for forming the above-described heat pipe is also provided.
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: August 15, 2006
    Assignee: Thermal Corp.
    Inventors: Matthew Connors, Arthur H. Good
  • Patent number: 6907918
    Abstract: A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein a portion of the wall is convex to a second position wherein the portion of the wall is concave. The convex wall may include at least one stress concentrator so that upon an application of a force to the convex wall, the stress concentrator causes the convex wall to buckle. A method for forming a heat pipe is also provided comprising coating the interior surface of the vessel with a wicking material and partially saturating the wick with a working fluid. The vessel is then partially evacuated. A portion of the vessel is pinched-off so as to seal the vessel.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: June 21, 2005
    Assignee: Thermal Corp.
    Inventors: Matthew Connors, Arthur H. Good
  • Publication number: 20040163799
    Abstract: A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein a portion of the wall is convex to a second position wherein the portion of the wall is concave. The convex wall may include at least one stress concentrator so that upon an application of a force to the convex wall, the stress concentrator causes the convex wall to buckle. A method for forming a heat pipe is also provided comprising coating the interior surface of the vessel with a wicking material and partially saturating the wick with a working fluid. The vessel is then partially evacuated. A portion of the vessel is pinched-off so as to seal the vessel.
    Type: Application
    Filed: February 10, 2003
    Publication date: August 26, 2004
    Inventors: Matthew Connors, Arthur H. Good
  • Publication number: 20030183373
    Abstract: A heat dissipation structure for electronics including a first heat sink for dissipating heat produced by a first processing unit (e.g., a Central Processing Unit (CPU)), a second heat sink for dissipating heat produced by a second processing unit (e.g., a Graphics Processing Unit (GPU)) and, a heat pipe interconnecting the first and second heat sinks. By connecting the CPU and GPU heat sinks, heat generated by the GPU can be transferred to the CPU where it can be more effectively cooled.
    Type: Application
    Filed: March 28, 2002
    Publication date: October 2, 2003
    Inventors: David Sarraf, Robert E. DeHoff, Arthur H. Good, Leland James