Abstract: A transfer switch comprising a housing and a strip of metal enclosed in the housing, each end extending through the housing as a first connection. At least one first contact is integral to the metal strip. At least one second contact within the housing extends through the housing wall for a second electrical connection. At least one first section of the metal strip for severing and at least one second section of the metal strip having the properties of a hinge for pivoting. At least one exothermic source in the proximity of the first section that upon ignition severs the metal strip at the first section, and causes at least one segment of the severed metal strip to be propelled about the second section comprising the hinge, whereupon the first electrical contact is propelled to join the second electrical contact.

Abstract: Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output device is substantially equal and minimal for each device. In this way, each device exhibits substantially the same impedance, such that circuit performance is largely a function of intrinsic device characteristics, and substantially independent of cross coupling and other external influences.

Abstract: Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output device is substantially the same impedance, such that circuit performance is largely a function of intrinsic device characteristics, and substantially independent of cross coupling and other external influences.

Abstract: Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output device is substantially equal and minimal for each device. In this way, each device exhibits substantially the same impedance, such that circuit performance is largely a function of intrinsic device characteristics, and substantially independent of cross coupling and other external influences.

Abstract: There is described a fuse comprising a housing and a current carrying strip of metal comprising a fuselink enclosed in the housing, each end of which electrically extends through the housing as an electrical connection. There being at least one first section of the metal strip for severing upon predetermined fault conditions, and at least one second section of the metal strip, distanced from the first section, having the properties of a hinge for pivoting. There further being at least one exothermic source in the proximity of the first section that substantially upon severance of the metal strip at the first section is ignited, and causes at least one segment of the severed metal strip to be propelled about the second section comprising the hinge. There further being an arc chute in proximity to the path of the moving severed edge of the first section such that fault current limiting is obtained.

Abstract: There is described a novel arc extinction method for use in switchgear, and improved, low cost power switchgear incorporating the novel arc quenching method. By physically severing the arc and the substantially simultaneous interposition of a high dielectric strength insulating barrier between the fixed contact and the moving contact, substantially consistent and predictable arc extinguishing characteristics are obtained. When the dielectric strength of the barrier exceeds the applied voltage, the arc cannot maintain itself nor can it reignite. Upon detection of a fault, moving contact 16 disengages from fixed contact 12 and retreats 28 from contact 12 creating arc 30. Insulating guillotine 24, in intimate sliding contact with the surface of insulating partition 18 moves 26 toward aperture 20 in partition 18. When edge 31 of guillotine 24 reaches aperture edge 33 of partition 18, arc 30 is severed and extinguished.

Abstract: The present invention, in one form, is an apparatus for interrupting current flow between a fixed contact and a movable contact. An insulating partition has an aperture, and the fixed contact and movable contact are on opposite sides of the partition aperture. The movable contact is coupled to a first movable electrically insulating member, and the first insulating member is coupled to a second movable insulating member, each member being adjacent the partition. A third movable insulating member is coupled to the partition opposite the first and second insulating members with respect to the aperture. The third insulating member extends partially over the aperture. The first and second member are coupled to the movable contact so that when the movable contact is moved to an open current-interrupting position, the second insulating member covers the aperture, and the first insulating member engages the third insulating member and covers both the second insulating member and the aperture.

Abstract: There is described method and apparatus to obtain synchronized switching of switchgear. A superposition of forces is used wherein the moving contacts of switchgear driven by a conventional operating mechanism has a secondary force, either opposing or aiding, superimposed upon the mechanism force under predetermined conditions to incrementally either slow down or speed up the moving contact. The computed secondary force is applied by a small servo-motor attached to the moving contact shaft. The energy of the secondary force is derived from a real time comparison of the measured position of the moving contact with its preprogrammed position in ROM at each predetermined point on the voltage or current waveform. From this comparison the required pulse energy is calculated and fed to the servo-motor which translates into the secondary force of appropriate duration thereby making the necessary incremental velocity correction.

Abstract: There is described a novel arc extinction method for use in switchgear, and improved, low cost power switchgear incorporating the novel arc quenching method. By physically severing the arc and the substantially simultaneous interposition of a high dielectric strength insulating barrier between the fixed contact and the moving contact, substantially consistent and predictable arc extinguishing characteristics are obtained. When the dielectric strength of the barrier exceeds the applied voltage, the arc cannot maintain itself nor can it reignite. Upon detection of a fault, moving contact 16 disengages from fixed contact 12 and retreats 28 from contact 12 creating arc 30. Insulating guillotine 24, in intimate sliding contact with the surface of insulating partition 18 moves 26 toward aperture 20 in partition 18. When edge 31 of guillotine 24 reaches aperture edge 33 of partition 18, arc 30 is severed and extinguished.

Abstract: Power output switching circuit (215) for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric parallel spaced semiconductor converters (214A, 214B, 216A, 216B) arranged such that the voltage for each semiconductor output device is substantially equal and minimal for each device. In this way, each device exhibits substantially the same impedance, such that circuit performance is largely a function of intrinsic device characteristics, and substantially independent of cross coupling and another external influences.

Abstract: A semi-conductor assembly including an elongated electrically conductive support structure defining a sinuous coolant flow path between respective upper and lower surfaces of the support structure. The sinuous coolant path includes alternating concave and convex coolant surfaces. A first series of semi-conductor devices is secured in a thermally intimate manner to the upper surface of the support structure, and a second series of semi-conductor devices is secured in a thermally intimate manner to the lower surface of the support structure. Each semi-conductor device is disposed proximate a concave curved surface of the coolant path.

Abstract: There is disclosed a unitized rotating shaft assembly comprising an outer alignment sleeve within which are mounted a rotating ferrofluid seal, a first bearing, a stator a second bearing and a rotating union; there being a first follow shaft affixed to the inner races of the first and second bearing, the hollow shaft having stators mounted opposing the rotor and there being a second hollow shaft concentric with the first hollow shaft to provide separate conduits for the input and discharge of coolant.

Abstract: Means for enhancing heat transfer from liquid cooled rotating anode x-ray tubes that provide for extended surfaces on the liquid cooled concave curved heat exchange surfaces opposing the electron beam focal track. The extended surfaces take the form of fins lying in the direction of coolant flow, said fins preferably being generally triangular in cross section.

Abstract: A method and apparatus are disclosed for the manufacture of a sheathed superconducting ceramic strip. The apparatus includes a chill wheel and metal casting apparatus wherein means are provided within the metal casting apparatus to cause oxygen to react with molten metal, comprising the base alloy from which a superconducting ceramic is formed, in a controlled manner. Strips of superconducting ceramic partially sheathed in the molten metal emerge from the metal casting apparatus and are engaged by the chill wheel, which solidifies the molten metal to form a continuous strip.

Abstract: The present invention provides an internally liquid cooled rotating target of high average power capabilities that is illuminated by an energy beam wherein multiple independent centrifugal forces are established on an associated heat transfer surface to enhance heat transfer.

Abstract: There is disclosed a liquid cooled high power semi-conductor structure comprising multiple stacked semi-conductor devices each having at least one surface prepared with a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, there being multiple semi-conductor devices stacked with heat exchange surfaces of adjacent or semi-conductor devices opposing each other, said heat exchange surfaces being spaced apart to form a coolant conduit, the several coolant conduits being fed coolant in parallel by a common input conduit and the discharge coolant feeding in parallel into a common discharge conduit, said stacked semi-conductor devices being electrically connected in series or some combination of series parallel.

Abstract: There is disclosed a liquid cooled multi-chip semi-conductor module comprising multiple semi-conductor devices each having one surface prepared with electrical interconnect means for mechanical and electrical attachment to an electrical interconnect substrate, said semi-conductor device having a surface opposing said surface prepared with said electrical interconnect means, said opposing surface being a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, one surface of said conduit having apertures corresponding in placement and geometry to said heat transfer surfaces of said semi-conductor devices mounted on said electrical interconnect means wherein said heat transfer surfaces and said conduit surface containing said apertures are approximately coincident thereby providing an approximate

Abstract: There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink of modular construction suitable for semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said modular heat sink containing inserts with chip substrates made of metals, such as tungsten or molybdenum, said substrate including at least one surface suitable for bonding one or more semi-conductor chips in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said module providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, the improvement wherein said heat sink module comprises individual heat sink inserts upon which semi-conductor chips are intimately bonded, said heat sink element being provided with means to electrically isolate each heat sink eleme

Abstract: There is disclosed a wafer scale semi-conductor module stack comprising at least one wafer scale semi-conductor device mounted on each of the two surfaces of an electrical interconnect substrate, said devices having their active devices facing said substrate with means being provided whereby said substrate and said devices are electrically and mechanically attached, the opposing surfaces of said devices being the heat exchange surfaces wherein heat is removed by flowing two-phase cooling, and there being multiple substrates positioned parallel to each other and sharing a common axis, each substrate being spaced apart such as to provide a conduit between opposing devices for the flow of coolant and said conduits being fed by an input conduit with coolant discharge through an output conduit, said substrates being attached to common support posts.

Abstract: Power output switching circuit (215) for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric parallel spaced semiconductor converters (214A, 214B, 216A, 216B) arranged such that the voltage for each semiconductor output device is substantially equal and minimal for each device. In this way, each device exhibits substantially the same impedance, such that circuit performance is largely a function of intrinsic device characteristics, and substantially independent of cross coupling and another external influences.