Abstract: The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.

Abstract: An integrated semiconductor package comprising a semiconductor body having a first surface and a plurality of pins, each pin having first and second ends. Also disclosed is an apparatus for connecting the first end of each pin to the first surface of the semiconductor body so that the semiconductor body provides the physical integrity to support the pins above and substantially perpendicular to the first surface. The apparatus of connecting the first end of each pin to the first surface comprises a plurality of metalization interconnects. A metalization interconnect is interspaced between the first end of each pin and the first surface of the semiconductor body. The pins are arranged in an array so that the second end of each pin can be removably inserted into a pin-grid socket.

Abstract: A selective method of etching chromium is described. In the present invention an etching cycle, including etching with a first solution including potassium permanganate and then with a second solution including oxalic acid is defined. Such a cycle will remove a thin layer of chromium and may be required to be performed a plurality of times to complete the etching process.

Abstract: A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components. Limited ranges in the composition of, and the amount of, the binder particularly the amount of copper oxide are effective to produce adhesion of the composition to fired substrates and in permitting copper leads of electronic devices to be soldered to pads of the gold composition using a lead-indium solder after the composition has been fired on a substrate. Strong solder joints are produced without the necessity for physically or chemically cleaning the pads prior to soldering. The binders comprise certain amounts of the crystalline materials, copper in the form of copper oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.

Abstract: Exposed surfaces of a layer of a copper thick film paste on a multilayer substrate are cleaned after being fired so that such surfaces are readily solderable to the extent that conventional tin/lead solders will wet said surfaces. The substrate with the exposed surfaces of a layer of a fired copper thick film paste is cleaned by being immersed in a warm dilute solution of an acid containing a fluoride ion, such as HF or HBF.sub.4 for a short period of time. After the short period of time of immersion has elapsed, the substrate is removed from the dilute acid solution and rinsed to remove substantially all traces of the cleaning solution.

Abstract: A solderable conductor pattern is formed on a ceramic substrate. The material of the conductor pattern is made by dispersing gold and certain inorganic binders in an inert liquid vehicle composition. Limited variations in the ranges of the amounts of the material in the composition particularly the range in the amount of copper oxide in the binder produce good adhesion of the pattern to fired substrates and simultaneously provide strong solder joints between leads of electronic devices soldered with a lead-indium solder to pads of a pattern of such material after the pattern has been fired on a substrate without the necessity for physically or chemically cleaning the pads. The binders of the material comprise certain amounts of the crystalline materials, copper in the form of its oxides CuO or Cu.sub.2 O, cadmium in the form of CdO, lead in the form of PbF.sub.2, and the balance being a glass which also contains lead and some cadmium.

Abstract: A solderable gold conductor composition is formed by dispersing gold and certain inorganic binders in an inert liquid vehicle composition which can be used to produce conductor patterns which patterns adhere to fired ceramic substrates and to which can be soldered leads of electronic components.A method of soldering a copper lead to a lead pad on a substrate. A conductor pattern including at least one lead pad is printed on the substrate using a gold thick film paste composition. The gold composition is composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, containing by weight 98-99 percent gold particles and complementally 2-1 percent of inorganic binder particles. The binder consists essentially by total weight of gold and binder of 0.6-0.2 percent copper, 0.2 percent lead, 0.2 percent cadmium and the balance being glass.

Abstract: An improved method of forming raised input/output (I/O) terminals on the top surfaces of semiconductor elements of a semiconductor wafer. After via openings are formed through the passivation layer of such elements at locations where the I/O terminals are to be formed, which openings provide access to the metalization layers of the elements photolithographic techniques using a layer of heat resistant photoresist which is laminated to the top surface of the wafer are used to form openings through the photoresist layer to provide access to the metalization layers through the vias. A barrier metal layer is deposited on the exposed surfaces of the photoresist, and the metalization layers, and passivation layer of the elements. The barrier metal layer overlying the photoresist and then the photoresist are stripped from the wafer. The same photolithographic techniques using the same heat resistant photoresist material are used to define openings surrounding the barrier metal lining the via openings.

Abstract: A method of protecting from physical damage the upper surface of medium and large scale integrated IC circuit chips. Certain types of IC chips are provided with a plurality of input/output terminals, or bumps, which project above the upper surface of the chips on which they are formed. The upper surface of each such chip, including its bumps, are spin coated with a thin adhesion promoter which is then dried. The chips and its terminals are next spin coated with a layer of a heat curable resin which is partially cured. The resin and the adhesion promoter are then removed from the upper surfaces of the bump by rubbing with a soft abrasive material. The resin remaining on each IC chip is then finally cured.