Abstract: A semiconductor wafer (1a, 1b) including a plurality of chips (2) and a separation zone (3) spacing the semiconductor chips (2) from each other in this wafer (1a, 1b), such a separation zone (3) extending from a front face (4a) to an opposite backside face (4b) of this wafer (1a, 1b), this separation zone (3) includes a scribe line (6) configured to be diced using plasma etching and an inlet area (13) of this scribe line (6), the inlet (13) being delimitated by free ends of plasma etch-resistant material layers (9) extending each from a peripheral wall (20) of a functional part (18) of a chip (2) into the scribe line (6) by overlapping a top of a seal ring (7) of this chip (2).

Abstract: An RFID assembly and an assembly method thereof are provided. The assembly method for an RFID assembly comprises a step of providing at least one integrated circuit which includes at least one IC contact and at least one dielectric layer, and a deposition of at least one electrical contact and of at least one re-passivation layer. The at least one electrical contact is deposited on at least one first portion and the at least one re-passivation layer is deposited on at least one second portion, which is distinct of the at least one first portion.