Patents by Inventor Arthur K. May

Arthur K. May has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for removing a soldered device from a printed circuit board
    Patent number: 6607113
    Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.
    Type: Grant
    Filed: November 14, 2001
    Date of Patent: August 19, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: Michael C. Cilia, Gurpreet S. Dayal, Don Nguyen, Arthur K. May
  • Apparatus and method for removing a soldered device from a printed circuit board
    Patent number: 6360934
    Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: March 26, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: Michael C. Cilia, Gurpreet S. Dayal, Don Nguyen, Arthur K. May
  • Apparatus and method for removing a soldered device from a printed circuit board
    Publication number: 20020033409
    Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.
    Type: Application
    Filed: November 14, 2001
    Publication date: March 21, 2002
    Inventors: Michael C. Cilia, Gurpreet S. Dayal, Don Nguyen, Arthur K. May