Abstract: Forming a stacked multiple electronic component interconnect structure includes mounting a first double sided land grid to a first surface of a flexible cable and attaching a second double sided land grid array to a second surface of the flexible cable. A first electronic component is attached to a first surface of the first double sided land grid array and a second electronic component is secured to a second surface of the second double sided land grid array to form a stacked multiple electronic component interconnect structure. The stacked multiple electronic component interconnect structure is attached to a circuit board having an electronic component interface cavity. The second electronic component is mounted in the electronic component interface cavity. Finally, the method includes attaching a force member to apply a compressive force to the stacked multiple electronic component interconnect structure to maintain electrical contact between the first and second electronic components.