Abstract: An improved electrical connection between a leadless chip carrier and one or more circuits on a printed circuit board is disclosed. A solder fillet connects a metallization layer on the groove face of the carrier to the printed circuit. The solder fillet is fused to only a portion of the full length of the metallization layer, thereby permitting the unfused layer portion to flex when differential expansion and contraction between the carrier and the substrate occurs. Thus, the solder fillet is only minimally stressed and the chance of failure of the connection due to cracking is reduced. The center of the carrier may be mechanically fastened to the substrate in order to equalize the differential expansion between different parts of the carrier and the substrate.