Patents by Inventor Arthur Paul Riaf

Arthur Paul Riaf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin wafer support assembly
    Patent number: 8963337
    Abstract: A semiconductor wafer assembly formed by bonding a support wafer to a thin wafer using a double-sided bonding release tape. The support wafer provides support for the thin target wafer such that existing handling tools can accommodate transporting and processing the assembly without compromising the profile of the thin target wafer.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: February 24, 2015
    Assignee: Varian Semiconductor Equipment Associates
    Inventor: Arthur Paul Riaf
  • THIN WAFER SUPPORT ASSEMBLY
    Publication number: 20120074591
    Abstract: A semiconductor wafer assembly formed by bonding a support wafer to a thin wafer using a double-sided bonding release tape. The support wafer provides support for the thin target wafer such that existing handling tools can accommodate transporting and processing the assembly without compromising the profile of the thin target wafer.
    Type: Application
    Filed: September 29, 2010
    Publication date: March 29, 2012
    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventor: Arthur Paul Riaf