Abstract: A device is provided for accommodating disk-shaped objects, preferably semiconductor wafers for a thermal treatment thereof. The device has a carrier with at least two recesses for respective objects, and at least one cover for covering at least one of the recesses. A handling apparatus is also provided and has at least one transport arm, at least one support arm, at least one support drive provided on the arm for supporting, via vacuum, at least one object that is to be handled, a device for determining the individual weight of an object, and a vacuum control device for altering the vacuum as a function of the individual weight of an object.

Abstract: A device for receiving plate-shaped objects, preferably semiconductor wafers, for the thermal treatment thereof, enabling the processing of wafers made of connecting semiconductors in a particularly simple manner. The inventive device offers high productivity and low risk of damage as a carrier has at least two recesses for respectively receiving an object. The recesses on the carrier can preferably be provided with covers. Preferably, support pins are provided for loading and unloading purposes. The carrier and the support pins can move in a vertical direction in relation to each other. A handling device for objects is also disclosed.

Abstract: A method of formally treating at least one layer for activating foreign atoms passivated in the layer by hydrogen is provided. The at least one layer is heated, in a first time interval of less than 120 seconds, above a first temperature at which a specific sheet resistance of the at least one layer decreases. The at least one layer is heated, in a second time interval which is within the first time interval and is less than 60 seconds, to above a decomposition temperature of the layer. Charge carriers are produced in the at least one layer during at least one third time interval, by electromagnetic radiation, wherein the energy of such electromagnetic radiation is greater than an energy gap of the at least one layer.