Abstract: A package for a high power electrical component includes a base and a plate disposed on a support surface of the base and having an electrically insulative layer and an outer layer having a conductive portion thereon. An electrically conductive pad is disposed on the electrically conductive portion of the plate and the electrical component is disposed on the pad. A cover is disposed atop the base and encloses the plate, the pad and the electrical component. First and second electrically conductive terminals extend through apertures in the cover and are electrically coupled to the electrodes of the electrical component. The cover is hermetically sealed to the base and to the first and second terminals. The coefficient of thermal expansion of the base and cover are substantially equal to minimize stresses developed therein.