Abstract: A thin film electrode is fabricated from a non-metallic, non-conductive porous support structure having pores with micrometer-range diameters. The support may include a polymer film. A first surface of the support is metalized, and the pores are partially metallized to create metal tubes having a thickness within a range of 50 to 150 nanometers, in contact with the metal layer. An active material is disposed within metalized portions of the pores. An electrolyte is disposed within non-metalized portions of the pores. Active materials may be selected to create an anode and a cathode. Non-metalized surfaces of the anode and cathode may be contacted to one another to form a battery cell, with the non-metalized electrolyte-containing portions of the anode facing the electrolyte-containing portions of the cathode pores. A battery cell may be fabricated as, for example, a nickel-zinc battery cell.

Abstract: A thin film electrode is fabricated from a non-metallic, non-conductive porous support structure having pores with micrometer-range diameters. The support may include a polymer film. A first surface of the support is metalized, and the pores are partially metallized to create metal tubes having a thickness within a range of 50 to 150 nanometers, in contact with the metal layer. An active material is disposed within metalized portions of the pores. An electrolyte is disposed within non-metalized portions of the pores. Active materials may be selected to create an anode and a cathode. Non-metalized surfaces of the anode and cathode may be contacted to one another to form a battery cell, with the non-metalized electrolyte-containing portions of the anode facing the electrolyte-containing portions of the cathode pores. A battery cell may be fabricated as, for example, a nickel-zinc battery cell.

Abstract: Thin-film electrodes and battery cells, and methods of fabrication. A thin film electrode may be fabricated from a non-metallic, non-conductive porous support structure having pores with micrometer-range diameters. The support may include a polymer film. A first surface of the support is metalized, and the pores are partially metallized to create metal tubes having a thickness within a range of 50 to 150 nanometers, in contact with the metal layer. An active material is disposed within metalized portions of the pores. An electrolyte is disposed within non-metalized portions of the pores. Active materials may be selected to create an anode and a cathode. Non-metalized surfaces of the anode and cathode may be contacted to one another to form a battery cell, with the non-metalized electrolyte-containing portions of the anode facing the electrolyte-containing portions of the cathode pores. A battery cell may be fabricated as, for example, a nickel-zinc battery cell.

Abstract: Thin-film electrodes and battery cells, and methods of fabrication. A thin film electrode may be fabricated from a non-metallic, non-conductive porous support structure having pores with micrometer-range diameters. The support may include a polymer film. A first surface of the support is metalized, and the pores are partially metallized to create metal tubes having a thickness within a range of 50 to 150 nanometers, in contact with the metal layer. An active material is disposed within metalized portions of the pores. An electrolyte is disposed within non-metalized portions of the pores. Active materials may be selected to create an anode and a cathode. Non-metalized surfaces of the anode and cathode may be contacted to one another to form a battery cell, with the non-metalized electrolyte-containing portions of the anode facing the electrolyte-containing portions of the cathode pores. A battery cell may be fabricated as, for example, a nickel-zinc battery cell.

Abstract: The index of refraction in a length of doped and/or “doped-and-poled” electro-optic polymers is controlled so that a gradual transition from a low ?n to a high ?n, or vice versa, is achieved for use in, for example, a lightguide-to-fiber transition. Multiple methods for creating this gradual transition are disclosed.

Abstract: A gating grid for deflecting ions includes an insulating substrate (16), a conducting layer (28) adhered to the insulating substrate (16), and interdigitated electrodes (14) patterned in the conducting layer by a photolithographic process. A hole (18) in the insulating substrate beneath the interdigitated electrodes allows ions to pass through the hole in the substrate. A process for making a gating grid for deflecting ions includes adhering a conducting layer (28) to an insulating substrate (16), forming interdigitated electrodes (14) on the conducting layer (28), and then forming a hole (18) in the insulating substrate beneath the interdigitated electrodes.

Abstract: A gating grid for deflecting ions includes an insulating substrate (16), a conducting layer (28) adhered to the insulating substrate (16), and interdigitated electrodes (14) patterned in the conducting layer by a photolithographic process. A hole (18) in the insulating substrate beneath the interdigitated electrodes allows ions to pass through the hole in the substrate. A process for making a gating grid for deflecting ions includes adhering a conducting layer (28) to an insulating substrate (16), forming interdigitated electrodes (14) on the conducting layer (28), and then forming a hole (18) in the insulating substrate beneath the interdigitated electrodes.

Abstract: A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.

Abstract: A method of electrolessly gold plating copper on a printed circuit board (PCB). Starting with a copper patterned PCB, steps include: clean with ultrasonic agitation with the PCB initially oriented vertically and gradually moved to a 45° angle; rinse; sulfuric acid bath with ultrasonic and mechanical agitation; rinse; another sulfuric acid bath with ultrasonic and mechanical agitation; plate the copper with palladium with ultrasonic agitation with the PCB initially oriented at a 45° angle and flipped half way through to opposing 45° angle; rinse; post dip in sulfuric acid; rinse; electrolessly nickel plate with mechanical agitation; rinse; nitrogen blow dry; visual inspection for nickel coverage of the copper; hydrochloric acid bath with manual agitation; rinse; if full nickel coverage was not achieved, repeat preceding steps starting with second sulfuric acid bath; gold flash plate to establish a first layer of gold; rinse; autocatalytic gold plate; rinse; and nitrogen blow dry.