Abstract: Devices and methods for performing a procedure within a spine are disclosed herein. In one embodiment, a method includes disposing an implant adjacent a side of a spinous process. A first portion of the implant is placed over a top side of the spinous process in a lateral direction. A second portion of the implant is placed under a bottom side of the spinous process in a lateral direction such that at least a portion of the spinous process is disposed within an interior region defined by the implant. In another embodiment, an apparatus includes an implant configured to be coupled to a spinous process. The implant has an outer surface configured to contact at least one of a second implant or an interspinous-process spacer. A closure member is coupled to the implant and has an open configuration and a closed configuration to secure the implant to the spinous process.

Abstract: Devices and methods for performing a procedure within a spine are disclosed herein. In one embodiment, a method includes coupling a first C-shaped implant to a first spinous process. A second C-shaped implant is coupled to an adjacent second spinous process of the spinal column. At least a portion of an outer surface of the first implant is configured to contact at least a portion of an outer surface of the second implant when the spinal column is in extension. The outer surface of the first implant and the outer surface of the second implant being at a spaced distance from each other when the spinal column is in flexion.