Patents by Inventor Arthur W. Lopez, Jr.

Arthur W. Lopez, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Materials for use in forming electronic interconnect
    Patent number: 4655382
    Abstract: This invention provides a device for placing elongate joint-forming preforms such as solder columns on electronic components such as chip carriers using a water soluble retaining member which positions and holds the preforms while they are attached to the electronic component. The retaining member is then dissolved in hot or cold water. The retaining member is constructed of water soluble or water dispersible paper in combination with coatings of or layers of a water soluble material such as polyethyleneoxide. The water soluble retaining member can be a laminate of alternating layers of water soluble paper and water soluble polymeric material.
    Type: Grant
    Filed: November 12, 1985
    Date of Patent: April 7, 1987
    Assignee: Raychem Corp.
    Inventors: Geoffrey B. Wong, Arthur W. Lopez, Jr.