Abstract: A system that facilitates high-speed signaling between integrated circuit chips comprising a cable, wherein the cable includes a first and second active connector that facilitate communication between integrated circuit chips. The first active connector includes a capacitive receiver which receives a signal from a corresponding capacitive transmitter located on a first integrated circuit chip through capacitive coupling, and a transmitter which transmits a signal received by the capacitive receiver, through the interconnect medium within the cable, to the second active connector. The second active connector includes a receiver which receives a signal transmitted through the interconnect medium of the cable, and a capacitive transmitter which transmits the signal to a corresponding capacitive receiver located on a second integrated circuit chip through capacitive coupling.

Abstract: An apparatus includes a two-dimensional array of single-chip modules (SCMs) and at least one component. A respective SCM in the array includes at least a semiconductor die that is configured to communicate data signals by capacitive coupling using one or more proximity connectors in a first set of proximity connectors. The first set of proximity connectors are coupled to the semiconductor die. A second set of proximity connectors is coupled to at least the one component. At least the one component is coupled to semiconductor dies in two or more SCMs using one or more proximity connectors in the second set of proximity connectors thereby enabling communication of the data signals by capacitive coupling.

Abstract: A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to and/or coupled to the first surface.

Abstract: This invention relates to digitally measuring operating parameters, for example, temperature, within a semiconductor chip and making those measurements internally available to hardware, firmware, and software.

Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. By matching the wire line size in the flexible bridge to the size of circuits and/or signal pads on the chip and on the second component, the system allows signals to be sent between the circuits on the chip and the second component without having to change the scale of the interconnect, thereby alleviating wireability and bandwidth limitations of conventional chip packaging technologies.

Abstract: One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

Abstract: This invention relates to digitally measuring operating parameters, for example, temperature, within a semiconductor chip and making those measurements internally available to hardware, firmware, and software.

Abstract: One embodiment of the present invention provides a system that facilitates proximity communication using a bridge chip. This system includes a base chip with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The bridge chip is mounted to the base chip using a mounting, interconnection, and communication structure. The bridge chip is positioned so that a free end is proximate to a neighboring chip, thereby supporting proximity communication between the base chip and the neighboring chip.

Abstract: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.

Abstract: One embodiment of the present invention provides a technique for assembling semiconductor chips. First, multiple semiconductor chips are permanently laminated together into a plurality of laminated chip assemblies, wherein the semiconductor chips within the laminated chip assembly communicate with each other through electrically conductive connections. Next, laminated chip assemblies are stacked together to form a stack of semiconductor chips without permanently bonding the laminated chip assemblies together, wherein the laminated chip assemblies communicate with each other using capacitive coupling.

Abstract: One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.

Abstract: A spring array connector includes a unitary resilient layer of multiple springs having a layer of multiple electrically conducting lines, electrical contacts and electrical terminals. Each spring of the array is independently bendable and each of the conducting lines is electrically isolated from the other conducting lines. All of the springs in the spring array are fabricated simultaneously. Spring embodiments include sine, helix, cantilever and buckling beam shapes in sheet and wire forms.