Patents by Inventor ARUMUGA BALAN

ARUMUGA BALAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic chuck with embossed top plate and cooling channels
    Patent number: 10832931
    Abstract: An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: November 10, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chethan Mangalore, Arumuga Balan, Jeonghoon Oh
  • ELECTROSTATIC CHUCK WITH EMBOSSED TOP PLATE AND COOLING CHANNELS
    Publication number: 20150348813
    Abstract: An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.
    Type: Application
    Filed: April 27, 2015
    Publication date: December 3, 2015
    Inventors: CHETHAN MANGALORE, ARUMUGA BALAN, JEONGHOON OH