Patents by Inventor Arun K Agarwal

Arun K Agarwal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170217184
    Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.
    Type: Application
    Filed: April 11, 2017
    Publication date: August 3, 2017
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
  • Patent number: 9656469
    Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: May 23, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
  • Publication number: 20170050443
    Abstract: A replaceable integrated printhead cartridge is provided that comprises a liquid reservoir and a linear nozzle array being disposed in a bottom and extending perpendicular to a longitudinal axis.
    Type: Application
    Filed: September 24, 2014
    Publication date: February 23, 2017
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventor: Arun K. AGARWAL
  • Patent number: 9511585
    Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: December 6, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: James Elmer Abbott, Jr., Arun K. Agarwal, Roberto A. Pugliese, Greg Scott Long, Stephen Horvath, Douglas A. Keszler, John Wager, Kristopher Olsen, John McGlone
  • Publication number: 20160168675
    Abstract: The present disclosure is drawn to amorphous thin metal films and associated methods. Generally, an amorphous thin metal film can comprise a combination of four metals or metalloids including: 5 at % to 85 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 85 at % of a first metal; 5 at % to 85 at % of a second metal; and 5 at % to 85 at % of a third metal wherein each metal is independently selected from the group of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum, wherein the first metal, the second metal, and the third metal are different metals. Typically, the four elements account for at least 70 at % of the amorphous thin metal film.
    Type: Application
    Filed: July 12, 2013
    Publication date: June 16, 2016
    Applicants: Hewlett-Packard Development Company, L.P., Oregon State University
    Inventors: James Elmer ABBOTT, JR., Arun K. AGARWAL, Roberto A. PUGLIESE, Greg Scott LONG, Stephen HORVATH, Douglas A. KESZLER, John WAGER, Kristopher OLSEN, John MCGLONE
  • Publication number: 20160160331
    Abstract: The present disclosure is drawn to amorphous thin metal films and associated methods. Generally, an amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 90 at % of a first metal selected from the group of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum; and 5 at % to 90 at % of a second metal selected from the group of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum, wherein the second metal is different than the first metal. Typically, the three elements account for at least 70 at % of the amorphous thin metal film.
    Type: Application
    Filed: July 12, 2013
    Publication date: June 9, 2016
    Applicants: Hewlett-Packard Development Company, L.P., Oregon State University
    Inventors: James Elmer ABBOTT, JR., Arun K. AGARWAL, Roberto A. PUGLIESE, Greg Scott LONG, Stephen HORVATH, John WAGER, Douglas A. KESZLER, Kristopher OLSEN, John MCGLONE
  • Publication number: 20160096366
    Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.
    Type: Application
    Filed: June 27, 2013
    Publication date: April 7, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
  • Publication number: 20160075136
    Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.
    Type: Application
    Filed: July 12, 2013
    Publication date: March 17, 2016
    Applicants: Hewlett-Packard Development Company, L.P., Oregon State University
    Inventors: James Elmer ABBOTT, JR., Arun K. AGARWAL, Roberto A. PUGLIESE, Greg Scott LONG, Stephen HORVATH, Douglas A. KESZLER, John WAGER, Kristopher OLSEN, John MCGLONE
  • Publication number: 20160001465
    Abstract: In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.
    Type: Application
    Filed: March 20, 2013
    Publication date: January 7, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
  • Patent number: 8047156
    Abstract: The present disclosure is drawn to dice with polymer ribs. In one example, a die structure can comprise a die having a plurality of die slots, the die having polymer ribs attached to one side thereof, wherein the polymer ribs are attached using a polymer film on one side of the die, said polymer film having portions removed along the die slots to form the polymer ribs which bridge the die slots, thereby forming a plurality of polymer bridged die slots.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: November 1, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Manish Giri, Arun K. Agarwal, Bradley D. Chung, Jeremy Harlan Donaldson
  • Publication number: 20100231655
    Abstract: A printhead die (200) for an inkjet-printing device includes a substrate (302), a heating resistor, and an edge protection layer (209) The heating resistor is formed on the substrate, and has one or more edges The heating resistor is operative to cause an ink droplet to be ejected from the inkjet-printing device upon sufficient current flowing through the heating resistor resulting in a bubble nucleating within ink at the heating resistor and thereafter collapsing at the heating resistor The edge protection layer covers just the edges of the heating resistor in order to at least substantially protect the heating resistor from becoming damaged due to collapsing of the bubble at the heating resistor
    Type: Application
    Filed: November 24, 2007
    Publication date: September 16, 2010
    Applicant: Hewlett-Packard Developement Company, L.P.
    Inventors: Bradley D. Chung, Arun K. Agarwal, Galen P. Cook, Sadiq Bengali, Christopher A. Leonard
  • Patent number: 7517056
    Abstract: A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction. The fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction. As such, the fluid restriction parameter is in a range of 1.5 to 5.75.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: April 14, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Elizabeth A. Fellner, James Pingel, Matthew David Giere, Satya Prakash, David W Jenkins, James A Feinn, Arun K Agarwal, Julie J Cox, Jules G Moritz, Ozgur Yildirim
  • Publication number: 20090011185
    Abstract: The present disclosure is drawn to embodiments of dies having polymer ribs.
    Type: Application
    Filed: July 2, 2007
    Publication date: January 8, 2009
    Inventors: Manish Giri, Arun K. Agarwal, Bradley D. Chung, Jeremy Harlan Donaldson
  • Patent number: 7431434
    Abstract: A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction, wherein a width of the fluid restriction is in a range of approximately 8 microns to approximately 16 microns, and a length of the fluid restriction is in a range of approximately 5 microns to approximately 20 microns.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: October 7, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arun K Agarwal, Julie J Cox, Jules G Moritz, Ozgur Yildirim
  • Patent number: 7332023
    Abstract: Disclosed is an ink composition that includes a colorant; a water-soluble organic solvent; and a penetrant, where the penetrant may be a hydroxylated pentane. Also disclosed is an ink composition that includes a penetrant that enables the ink composition to maintain a drop weight of at least about 4.5 ng at high operating frequencies of an ink drop generator of the ink-jet printer.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: February 19, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Zia Ur Rehman, Jules G. Moritz, Arun K. Agarwal, Hiang P. Lauw
  • Patent number: 6594899
    Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, a protection layer having a first heating surface on the heater resistor and a second heating surface entirely surrounding the first heater surface on the heater resistor, and an ink ejection nozzle. The drop generator vaporizes ink at the first heating surface and ejects a drop of ink of a first mass from the nozzle when a first range of energies is applied to the heater resistor. The drop generator vaporizes ink at the first heating surface and the second heating surface and ejects a drop of ink of a second mass from the nozzle when a second range of energies is applied to the heater resistor.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: July 22, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert C. Maze, Todd A. Cleland, Arun K. Agarwal, Mark A. Buonanno
  • Patent number: 6527370
    Abstract: Novel designs and methods of manufacture of ink-jet printheads capable of providing ink-droplet-tail-break-off control and preventing meniscus overshoot in order to overcome the puddling, pen directionality, and ruffle problems associated with thermal-ink-jet printing are disclosed. A printhead for use in an ink-delivery system includes a substrate that has at least one ink ejector thereon. An orifice-plate member is positioned over and above the substrate. The orifice-plate member has at least one ink-transfer bore extending therethrough. The orifice-plate member further includes: a top surface that defines a top opening for the ink-transfer bore, a bottom surface that defines a bottom opening for the ink-transfer bore, and a counter-bore in the top surface that is in fluid communication with the ink-transfer bore. The counter-bore can be: concentric or non-concentric with the ink-transfer bore, a full or partial counter-bore, and symmetric or asymmetric.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: March 4, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Kenneth J. Courian, Arun K. Agarwal
  • Patent number: 6371596
    Abstract: A printhead having reduced spray includes orifi from which ink is expelled by an ink ejector. The orifi employ an aperture at the outer surface of the orifice plate having an asymmetrical hourglass shape to cause the expelled ink drop to break off at the narrow end of the orifice aperture.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: April 16, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Robert C. Maze, Timothy L Weber, Arun K Agarwal
  • Patent number: 6290331
    Abstract: A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface. The recess has an upper end with a first opening therein, a lower end with a second opening therein, a side wall, and a bottom wall at the lower end The first opening is larger than the second opening. Application of physical force to the plate does not disturb the second opening in the recess which is “inset”. The recessed bottom wall (and possibly the top surface) of the plate may include at least one layer of coating material thereon for protective, wettability-control, and other purposes. These designs insure proper ink drop trajectory and high-quality image generation.
    Type: Grant
    Filed: July 18, 2000
    Date of Patent: September 18, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Arun K. Agarwal, Jennifer Korngiebel, Kit Christopher Baughman, Matthew D. Giere, Ronald A. Askeland, Noah C. Lassar, Satya Prakash, Neal W. Meyer, Harold Lee Van Nice, Salim Khasawinah
  • Publication number: 20010008411
    Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, a protection layer having a first heating surface on the heater resistor and a second heating surface entirely surrounding the first heater surface on the heater resistor, and an ink ejection nozzle. The drop generator vaporizes ink at the first heating surface and ejects a drop of ink of a first mass from the nozzle when a first range of energies is applied to the heater resistor. The drop generator vaporizes ink at the first heating surface and the second heating surface and ejects a drop of ink of a second mass from the nozzle when a second range of energies is applied to the heater resistor.
    Type: Application
    Filed: February 14, 2001
    Publication date: July 19, 2001
    Inventors: Robert C. Maze, Todd A. Cleland, Arun K. Agarwal, Mark A. Buonanno