Patents by Inventor Arun K Agarwal
Arun K Agarwal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170217184Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.Type: ApplicationFiled: April 11, 2017Publication date: August 3, 2017Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
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Patent number: 9656469Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.Type: GrantFiled: June 27, 2013Date of Patent: May 23, 2017Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
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Publication number: 20170050443Abstract: A replaceable integrated printhead cartridge is provided that comprises a liquid reservoir and a linear nozzle array being disposed in a bottom and extending perpendicular to a longitudinal axis.Type: ApplicationFiled: September 24, 2014Publication date: February 23, 2017Applicant: Hewlett-Packard Development Company, L.P.Inventor: Arun K. AGARWAL
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Patent number: 9511585Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.Type: GrantFiled: July 12, 2013Date of Patent: December 6, 2016Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: James Elmer Abbott, Jr., Arun K. Agarwal, Roberto A. Pugliese, Greg Scott Long, Stephen Horvath, Douglas A. Keszler, John Wager, Kristopher Olsen, John McGlone
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Publication number: 20160168675Abstract: The present disclosure is drawn to amorphous thin metal films and associated methods. Generally, an amorphous thin metal film can comprise a combination of four metals or metalloids including: 5 at % to 85 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 85 at % of a first metal; 5 at % to 85 at % of a second metal; and 5 at % to 85 at % of a third metal wherein each metal is independently selected from the group of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum, wherein the first metal, the second metal, and the third metal are different metals. Typically, the four elements account for at least 70 at % of the amorphous thin metal film.Type: ApplicationFiled: July 12, 2013Publication date: June 16, 2016Applicants: Hewlett-Packard Development Company, L.P., Oregon State UniversityInventors: James Elmer ABBOTT, JR., Arun K. AGARWAL, Roberto A. PUGLIESE, Greg Scott LONG, Stephen HORVATH, Douglas A. KESZLER, John WAGER, Kristopher OLSEN, John MCGLONE
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Publication number: 20160160331Abstract: The present disclosure is drawn to amorphous thin metal films and associated methods. Generally, an amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 90 at % of a first metal selected from the group of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum; and 5 at % to 90 at % of a second metal selected from the group of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, and platinum, wherein the second metal is different than the first metal. Typically, the three elements account for at least 70 at % of the amorphous thin metal film.Type: ApplicationFiled: July 12, 2013Publication date: June 9, 2016Applicants: Hewlett-Packard Development Company, L.P., Oregon State UniversityInventors: James Elmer ABBOTT, JR., Arun K. AGARWAL, Roberto A. PUGLIESE, Greg Scott LONG, Stephen HORVATH, John WAGER, Douglas A. KESZLER, Kristopher OLSEN, John MCGLONE
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Publication number: 20160096366Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.Type: ApplicationFiled: June 27, 2013Publication date: April 7, 2016Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
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Publication number: 20160075136Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.Type: ApplicationFiled: July 12, 2013Publication date: March 17, 2016Applicants: Hewlett-Packard Development Company, L.P., Oregon State UniversityInventors: James Elmer ABBOTT, JR., Arun K. AGARWAL, Roberto A. PUGLIESE, Greg Scott LONG, Stephen HORVATH, Douglas A. KESZLER, John WAGER, Kristopher OLSEN, John MCGLONE
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Publication number: 20160001465Abstract: In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.Type: ApplicationFiled: March 20, 2013Publication date: January 7, 2016Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Arun K. Agarwal
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Patent number: 8047156Abstract: The present disclosure is drawn to dice with polymer ribs. In one example, a die structure can comprise a die having a plurality of die slots, the die having polymer ribs attached to one side thereof, wherein the polymer ribs are attached using a polymer film on one side of the die, said polymer film having portions removed along the die slots to form the polymer ribs which bridge the die slots, thereby forming a plurality of polymer bridged die slots.Type: GrantFiled: July 2, 2007Date of Patent: November 1, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Manish Giri, Arun K. Agarwal, Bradley D. Chung, Jeremy Harlan Donaldson
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Publication number: 20100231655Abstract: A printhead die (200) for an inkjet-printing device includes a substrate (302), a heating resistor, and an edge protection layer (209) The heating resistor is formed on the substrate, and has one or more edges The heating resistor is operative to cause an ink droplet to be ejected from the inkjet-printing device upon sufficient current flowing through the heating resistor resulting in a bubble nucleating within ink at the heating resistor and thereafter collapsing at the heating resistor The edge protection layer covers just the edges of the heating resistor in order to at least substantially protect the heating resistor from becoming damaged due to collapsing of the bubble at the heating resistorType: ApplicationFiled: November 24, 2007Publication date: September 16, 2010Applicant: Hewlett-Packard Developement Company, L.P.Inventors: Bradley D. Chung, Arun K. Agarwal, Galen P. Cook, Sadiq Bengali, Christopher A. Leonard
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Patent number: 7517056Abstract: A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction. The fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction. As such, the fluid restriction parameter is in a range of 1.5 to 5.75.Type: GrantFiled: February 13, 2006Date of Patent: April 14, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Elizabeth A. Fellner, James Pingel, Matthew David Giere, Satya Prakash, David W Jenkins, James A Feinn, Arun K Agarwal, Julie J Cox, Jules G Moritz, Ozgur Yildirim
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Publication number: 20090011185Abstract: The present disclosure is drawn to embodiments of dies having polymer ribs.Type: ApplicationFiled: July 2, 2007Publication date: January 8, 2009Inventors: Manish Giri, Arun K. Agarwal, Bradley D. Chung, Jeremy Harlan Donaldson
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Patent number: 7431434Abstract: A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction, wherein a width of the fluid restriction is in a range of approximately 8 microns to approximately 16 microns, and a length of the fluid restriction is in a range of approximately 5 microns to approximately 20 microns.Type: GrantFiled: May 31, 2005Date of Patent: October 7, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Arun K Agarwal, Julie J Cox, Jules G Moritz, Ozgur Yildirim
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Patent number: 7332023Abstract: Disclosed is an ink composition that includes a colorant; a water-soluble organic solvent; and a penetrant, where the penetrant may be a hydroxylated pentane. Also disclosed is an ink composition that includes a penetrant that enables the ink composition to maintain a drop weight of at least about 4.5 ng at high operating frequencies of an ink drop generator of the ink-jet printer.Type: GrantFiled: March 7, 2005Date of Patent: February 19, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Zia Ur Rehman, Jules G. Moritz, Arun K. Agarwal, Hiang P. Lauw
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Patent number: 6594899Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, a protection layer having a first heating surface on the heater resistor and a second heating surface entirely surrounding the first heater surface on the heater resistor, and an ink ejection nozzle. The drop generator vaporizes ink at the first heating surface and ejects a drop of ink of a first mass from the nozzle when a first range of energies is applied to the heater resistor. The drop generator vaporizes ink at the first heating surface and the second heating surface and ejects a drop of ink of a second mass from the nozzle when a second range of energies is applied to the heater resistor.Type: GrantFiled: February 14, 2001Date of Patent: July 22, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert C. Maze, Todd A. Cleland, Arun K. Agarwal, Mark A. Buonanno
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Patent number: 6527370Abstract: Novel designs and methods of manufacture of ink-jet printheads capable of providing ink-droplet-tail-break-off control and preventing meniscus overshoot in order to overcome the puddling, pen directionality, and ruffle problems associated with thermal-ink-jet printing are disclosed. A printhead for use in an ink-delivery system includes a substrate that has at least one ink ejector thereon. An orifice-plate member is positioned over and above the substrate. The orifice-plate member has at least one ink-transfer bore extending therethrough. The orifice-plate member further includes: a top surface that defines a top opening for the ink-transfer bore, a bottom surface that defines a bottom opening for the ink-transfer bore, and a counter-bore in the top surface that is in fluid communication with the ink-transfer bore. The counter-bore can be: concentric or non-concentric with the ink-transfer bore, a full or partial counter-bore, and symmetric or asymmetric.Type: GrantFiled: June 26, 2000Date of Patent: March 4, 2003Assignee: Hewlett-Packard CompanyInventors: Kenneth J. Courian, Arun K. Agarwal
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Patent number: 6371596Abstract: A printhead having reduced spray includes orifi from which ink is expelled by an ink ejector. The orifi employ an aperture at the outer surface of the orifice plate having an asymmetrical hourglass shape to cause the expelled ink drop to break off at the narrow end of the orifice aperture.Type: GrantFiled: August 30, 1999Date of Patent: April 16, 2002Assignee: Hewlett-Packard CompanyInventors: Robert C. Maze, Timothy L Weber, Arun K Agarwal
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Patent number: 6290331Abstract: A novel polymeric orifice plate for a printhead. The plate includes a recess in the top surface thereof which terminates at a position between the top and bottom plate surfaces. The recess communicates with a bore which passes through the remainder of the plate and terminates at the bottom surface. The recess has an upper end with a first opening therein, a lower end with a second opening therein, a side wall, and a bottom wall at the lower end The first opening is larger than the second opening. Application of physical force to the plate does not disturb the second opening in the recess which is “inset”. The recessed bottom wall (and possibly the top surface) of the plate may include at least one layer of coating material thereon for protective, wettability-control, and other purposes. These designs insure proper ink drop trajectory and high-quality image generation.Type: GrantFiled: July 18, 2000Date of Patent: September 18, 2001Assignee: Hewlett-Packard CompanyInventors: Arun K. Agarwal, Jennifer Korngiebel, Kit Christopher Baughman, Matthew D. Giere, Ronald A. Askeland, Noah C. Lassar, Satya Prakash, Neal W. Meyer, Harold Lee Van Nice, Salim Khasawinah
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Publication number: 20010008411Abstract: An inkjet printing device employs an inkjet printhead with a plurality of drop generators to eject drops of ink. Each drop generator includes a planar heater resistor, a protection layer having a first heating surface on the heater resistor and a second heating surface entirely surrounding the first heater surface on the heater resistor, and an ink ejection nozzle. The drop generator vaporizes ink at the first heating surface and ejects a drop of ink of a first mass from the nozzle when a first range of energies is applied to the heater resistor. The drop generator vaporizes ink at the first heating surface and the second heating surface and ejects a drop of ink of a second mass from the nozzle when a second range of energies is applied to the heater resistor.Type: ApplicationFiled: February 14, 2001Publication date: July 19, 2001Inventors: Robert C. Maze, Todd A. Cleland, Arun K. Agarwal, Mark A. Buonanno