Patents by Inventor Arun K. Varanasi

Arun K. Varanasi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder Pillars in Flip Chip Assembly
    Publication number: 20110169158
    Abstract: A semiconductor packaging system includes a semiconductor die and a solder pillar on a side of the semiconductor die extending outwardly from a side of the semiconductor die. The solder pillar electrically couples to an electrical contact of a packaging substrate, even when access to the electrical contact is limited by a mask.
    Type: Application
    Filed: January 14, 2010
    Publication date: July 14, 2011
    Applicant: QUALCOMM INCORPORATED
    Inventor: Arun K. Varanasi