Patents by Inventor Arun Maheshwari

Arun Maheshwari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968674
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive, from a base station, a control message indicating a resource configuration for uplink and downlink transmissions. The UE may determine an uplink buffer threshold for a modem buffer of the UE based on the resource configuration. The UE may transmit, to the base station, a feedback request message requesting that the base station provide feedback for at least one previously transmitted uplink packet based on a comparison of an amount of previously transmitted uplink data and scheduled uplink data stored in the modem buffer relative to the uplink buffer threshold. The UE may receive, based on transmitting the feedback request message, a feedback response message corresponding to a first previously transmitted uplink packet of the at least one previously transmitted uplink packet.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: April 23, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Arnaud Meylan, Sitaramanjaneyulu Kanamarlapudi, Vishal Dalmiya, Kuo-Chun Lee, Shailesh Maheshwari, Vaishakh Rao, Arun Prasanth Balasubramanian, Subashini Krishnamurthy, Leena Zacharias, Sivashankar Sekar, Saket Bathwal, Liangchi Hsu, Raghuveer Ramakrishna Srinivas Tarimala
  • Publication number: 20240080970
    Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.
    Type: Application
    Filed: March 16, 2023
    Publication date: March 7, 2024
    Applicant: Apple Inc.
    Inventors: Leilei ZHANG, Abhay Maheshwari, Ali N. Ergun, Arun Chawan
  • Publication number: 20030097457
    Abstract: A scalable software architecture (20) for business computer platforms implements a messaging platform (FIG. 3) for communicating messages among various dynamically connected components, preferably including a communication gateway (28) for communication with at least one external media channel (52-62), a data manager layer (22) for maintaining data in a connected database system (40), and a business workflow engine (26) for implementing predetermined business workflows leveraging customized business logic and business software objects (22). The messaging platform comprises a managing process (502) and at least one agent process (504) forming a serial chain for distributed port number assignments and implementing client registration (Table 1) for robust, reliable messaging.
    Type: Application
    Filed: August 8, 2002
    Publication date: May 22, 2003
    Inventors: Amitabh Saran, Mathews Manaloor, Arun Maheshwari, Sanjay Suri, Tarak Goradia