Abstract: Various embodiments of access control systems and fingerprint sensing systems are disclosed. One or more fingerprints of an authorized person are recorded in a fingerprint database together with a sequence of angular positions. The authorized person may subsequently gain access to a secured item by scanning the authorized person's finger or fingers in accordance with the sequence of angular positions. Various embodiments of fingerprint sensors for determining the angular position of a finger on the sensor are also disclosed.

Abstract: Various embodiments of access control systems and fingerprint sensing systems are disclosed. One or more fingerprints of an authorized person are recorded in a fingerprint database together with a sequence of angular positions. The authorized person may subsequently gain access to a secured item by scanning the authorized person's finger or fingers in accordance with the sequence of angular positions. Various embodiments of fingerprint sensors for determining the angular position of a finger on the sensor are also disclosed.

Abstract: Various embodiments of access control systems and fingerprint sensing systems are disclosed. One or more fingerprints of an authorized person are recorded in a fingerprint database together with a sequence of angular positions. The authorized person may subsequently gain access to a secured item by scanning the authorized person's finger or fingers in accordance with the sequence of angular positions. Various embodiments of fingerprint sensors for determining the angular position of a finger on the sensor are also disclosed.

Abstract: Various embodiments of access control systems and fingerprint sensing systems are disclosed. One or more fingerprints of an authorized person are recorded in a fingerprint database together with a sequence of angular positions. The authorized person may subsequently gain access to a secured item by scanning the authorized person's finger or fingers in accordance with the sequence of angular positions. Various embodiments of fingerprint sensors for determining the angular position of a finger on the sensor are also disclosed.

Abstract: Various embodiments of access control systems and fingerprint sensing systems are disclosed. One or more fingerprints of an authorized person are recorded in a fingerprint database together with a sequence of angular positions. The authorized person may subsequently gain access to a secured item by scanning the authorized person's finger or fingers in accordance with the sequence of angular positions. Various embodiments of fingerprint sensors for determining the angular position of a finger on the sensor are also disclosed.

Abstract: Various embodiments of access control systems and fingerprint sensing systems are disclosed. One or more fingerprints of an authorized person are recorded in a fingerprint database together with a sequence of angular positions. The authorized person may subsequently gain access to a secured item by scanning the authorized person's finger or fingers in accordance with the sequence of angular positions. Various embodiments of fingerprint sensors for determining the angular position of a finger on the sensor are also disclosed.

Abstract: Various embodiments of access control systems and fingerprint sensing systems are disclosed. One or more fingerprints of an authorized person are recorded in a fingerprint database together with a sequence of angular positions. The authorized person may subsequently gain access to a secured item by scanning the authorized person's finger or fingers in accordance with the sequence of angular positions. Various embodiments of fingerprint sensors for determining the angular position of a finger on the sensor are also disclosed.

Abstract: A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. The electrodes are quartered approximately parallel to or offset by 45 degrees from rotational axes to form quadrants. Torsion sensors are provided along the axes of rotation to control deflection of the quadrant deflection electrodes.

Abstract: A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. The electrodes are quartered approximately parallel to or offset by 45 degrees from rotational axes to form quadrants. Torsion sensors are provided along the axes of rotation to control deflection of the quadrant deflection electrodes.

Abstract: A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. The electrodes are quartered approximately parallel to or offset by 45 degrees from rotational axes to form quadrants. Torsion sensors are provided along the axes of rotation to control deflection of the quadrant deflection electrodes.

Abstract: A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. The electrodes are quartered approximately parallel to or offset by 45 degrees from rotational axes to form quadrants. Torsion sensors are provided along the axes of rotation to control deflection of the quadrant deflection electrodes.

Abstract: A magneto-optical head with a centrally-located solid immersion lens and a coil formed radially about the lens advantageously utilizes an insulating material with a relatively high thermal conductivity for isolating the coil and avoiding heat damage to the head when current is passed through the head during a write operation. First and second coils in first and second coil layers are coupled by a via to form a continuous coil. A combination of a chemical-mechanical contouring operation and the lack of any intervening low thermal conductivity material adjacent the coil effectively produces an insulation layer that is thin but has a contour with a very smooth surface, resulting in a highly compact multiple-level coil.

Abstract: Etched substrate produced by chemical-mechanical processing of a patterned substrate which selectively etches patterned portions of the substrate surface, producing deep narrow features with a rapid etch rate. This chemical-mechanical processing is termed chemical-mechanical etching and produces a result that is substantially the opposite of the planarization that is achieved by conventional chemical-mechanical polishing (CMP). A chemical-mechanical polishing (CMP) technique which is widely used for planarization of surfaces is converted for usage as an etching technique, a chemical-mechanical etching (CME) technique, by forming a patterned mask on the substrate surface prior to mechanical polishing. The usage of chemical-mechanical polishing techniques in this manner yields an etching method with properties including a rapid etch rate, a highly controllable etch rate, a highly controllable etch depth, and a greatly selective etch directionality.

Abstract: Chemical-mechanical processing of a patterned substrate selectively etches patterned portions of the substrate surface, producing deep narrow features with a rapid etch rate. This chemical-mechanical processing is termed chemical-mechanical etching and produces a result that is substantially the opposite of the planarization that is achieved by conventional chemical-mechanical polishing (CMP). A chemical-mechanical polishing (CMP) technique which is widely used for planarization of surfaces is converted for usage as an etching technique, a chemical-mechanical etching (CME) technique, by forming a patterned mask on the substrate surface prior to mechanical polishing. The usage of chemical-mechanical polishing techniques in this manner yields an etching method with properties including a rapid etch rate, a highly controllable etch rate, a highly controllable etch depth, and a greatly selective etch directionality.

Abstract: A thin film magnetic head is provided in which a magnetic yoke assembly is built up, layer by layer, atop a substrate using semiconductor thin film techniques. A lower yoke assembly is first fabricated including a lower magnetic layer situated on the substrate and first and second side poles built up vertically from the ends of the lower magnetic layer. A coil structure is situated about one of the side poles and is separated therefrom by planar insulative layers in which the coil structure is disposed. An insulative pedestal surrounded by a frame is formed at the top of the lower yoke assembly and extends above the uppermost lateral plane of the yoke assembly. A diamond-like carbon (DLC) wear layer is deposited atop the pedestal. A pole well is excavated in the DLC layer so as to expose the first and second side poles therebelow. A first magnetic pole including a gap end is plated in the pole well at the top of the first side pole and extending toward the second side pole.

Abstract: A thin film magnetic head is fabricated on a substrate by depositing a seed layer on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the seed layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by using the above seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer. A first upper pole is plated to the upper end of the first side pole. The first upper pole includes a gap end facing the second side pole. A gap region of nonmagnetic material is deposited adjacent the gap end of the first upper pole.

Abstract: A thin film magnetic head is provided in which a magnetic yoke assembly is built up, layer by layer, atop a substrate using semiconductor thin film techniques. A lower yoke assembly is first fabricated including a lower magnetic layer situated on the substrate and first and second side poles built up vertically from the ends of the lower magnetic layer. An insulative pedestal surrounded by a frame is formed at the top of the lower yoke assembly and extends above the uppermost lateral plane of the yoke assembly. A diamond-like carbon (DLC) wear layer is deposited atop the pedestal. First and second pole support wells are excavated in the DLC layer so as to expose the first and second side poles therebelow, and further to receive first and second pole supports, respectively, therein. First and second pole extension members are situated on the first and second pole support members, respectively, with a non-magnetic gap region being situated between the first and second pole extension members.

Abstract: A thin film magnetic head assembly is provided which includes a plurality of thin film heads situated atop a common substrate. An insulative main body is built up layer by layer on the substrate. A plurality of magnetic yokes exhibiting different geometries are situated on the substrate and within the main body. The magnetic yokes are built up layer by layer at the same time that the insulative main body is fabricated. A plurality of coil structures are situated within the main body and are magnetically coupled to respective magnetic yokes. The head assembly also includes a pedestal of insulative material situated atop the main body and exhibiting a lateral dimension less than that of the main body. The pedestal protrudes upwardly away from the main body and substrate. The magnetic yokes each include a pole piece pair situated atop the pedestal, each pole piece pair including first and second magnetic pole pieces. Each pole piece pair exhibits a different geometry than another pole piece pair.

Abstract: A thin film helical conductor coil assembly includes an electrically-nonconducting ceramic substrate having a substantially planar surface and separated first and second magnetic elements which mutually bound a volume of the ceramic substrate. The thin film conductor coil assembly also includes a thin film magnetic core, which magnetically connects the first magnetic element to the second magnetic element. The thin film magnetic core, which overlies the substantially planar surface of the ceramic substrate, is constructed from a compliant electroplated magnetic material. The thin film conductor coil assembly further includes an electroplated thin film helical coil which traverses about the thin film magnetic core and forms a conductive path from a first terminal to a second terminal.

Abstract: A thin film magnetic head is fabricated on a substrate by depositing a seed layer on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the seed layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by using the above seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer. A first upper pole is plated to the upper end of the first side pole. The first upper pole includes a gap end facing the second side pole. A gap region of nonmagnetic material is deposited adjacent the gap end of the first upper pole.