Patents by Inventor Arun Rajput

Arun Rajput has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150242539
    Abstract: A system and method for computing design parameters for a thermally comfortable environment is disclosed. In one embodiment, a surface heat transfer coefficient (hcal) is obtained for each body part of one or more thermal manikins in a uniform thermal environment by performing a 1D numerical analysis on the uniform thermal environment based on a given set of boundary conditions for the uniform thermal environment. Further, equivalent temperature (teq) limits for each body part corresponding to the thermal comfort limits are obtained from known design standards. Furthermore, heat flux limits (q_t limits) are obtained for each body part using associated teq limits and the hcal. In addition, the design parameters are computed by performing 1D numerical analysis on a non-uniform thermal environment, including one or more thermal manikins, based on a given set of boundary conditions for the non-uniform thermal environment and the obtained q_t limits.
    Type: Application
    Filed: August 5, 2013
    Publication date: August 27, 2015
    Inventors: Punit Tiwari, Arun Rajput, Madhusudhana Reddy