Patents by Inventor Arun Sankar Mampazhy

Arun Sankar Mampazhy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects
    Patent number: 10254642
    Abstract: Various embodiments include approaches for modifying a design layer of an integrated circuit (IC). In some cases, an approach includes: identifying at least one empty region in a design layer used to form the IC; determining whether the at least one empty region requires a fill object; placing at least one fill object in the at least one empty region and tagging the at least one fill object in response to determining the at least one empty region requires a fill object; performing a simplified optical proximity correction (OPC) on the tagged at least one fill object and a complete OPC on the design layer; and generating a modified design layer including a corrected version of the design layer and modified fill objects after the performing of the simplified OPC on the tagged at least one fill object and the complete OPC on the design layer.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: April 9, 2019
    Assignee: International Business Machines Corporation
    Inventors: Veeresh V. Deshpande, Howard S. Landis, Arun Sankar Mampazhy, Neelima Mandloi
  • MODIFYING DESIGN LAYER OF INTEGRATED CIRCUIT (IC)
    Publication number: 20180180989
    Abstract: Various embodiments include approaches for modifying a design layer of an integrated circuit (IC). In some cases, an approach includes: identifying at least one empty region in a design layer used to form the IC; determining whether the at least one empty region requires a fill object; placing at least one fill object in the at least one empty region and tagging the at least one fill object in response to determining the at least one empty region requires a fill object; performing a simplified optical proximity correction (OPC) on the tagged at least one fill object and a complete OPC on the design layer; and generating a modified design layer including a corrected version of the design layer and modified fill objects after the performing of the simplified OPC on the tagged at least one fill object and the complete OPC on the design layer.
    Type: Application
    Filed: January 31, 2018
    Publication date: June 28, 2018
    Inventors: Veeresh V. Deshpande, Howard S. Landis, Arun Sankar Mampazhy, Neelima Mandloi
  • Modifying design layer of integrated circuit (IC)
    Patent number: 9977325
    Abstract: Various embodiments include approaches for modifying a design layer of an integrated circuit (IC). In some cases, an approach includes: identifying at least one empty region in a design layer used to form the IC; determining whether the at least one empty region requires a fill object; placing at least one fill object in the at least one empty region and tagging the at least one fill object in response to determining the at least one empty region requires a fill object; performing a simplified optical proximity correction (OPC) on the tagged at least one fill object and a complete OPC on the design layer; and generating a modified design layer including a corrected version of the design layer and modified fill objects after the performing of the simplified OPC on the tagged at least one fill object and the complete OPC on the design layer.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: May 22, 2018
    Assignee: International Business Machines Corporation
    Inventors: Veeresh V. Deshpande, Howard S. Landis, Arun Sankar Mampazhy, Neelima Mandloi
  • MODIFYING DESIGN LAYER OF INTEGRATED CIRCUIT (IC)
    Publication number: 20170108769
    Abstract: Various embodiments include approaches for modifying a design layer of an integrated circuit (IC). In some cases, an approach includes: identifying at least one empty region in a design layer used to form the IC; determining whether the at least one empty region requires a fill object; placing at least one fill object in the at least one empty region and tagging the at least one fill object in response to determining the at least one empty region requires a fill object; performing a simplified optical proximity correction (OPC) on the tagged at least one fill object and a complete OPC on the design layer; and generating a modified design layer including a corrected version of the design layer and modified fill objects after the performing of the simplified OPC on the tagged at least one fill object and the complete OPC on the design layer.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 20, 2017
    Inventors: Veeresh V. Deshpande, Howard S. Landis, Arun Sankar Mampazhy, Neelima Mandloi