Abstract: The invention is directed to a polypropylene composition having improved scratch resistance properties, wherein the polypropylene composition comprises (i) ?50.0 wt. % and ?90.0 wt. % of a propylene polymer, (ii) ?5.0 wt. % and ?30.0 wt. % of an elastomeric ethylene alpha-olefin co-polymer, and (iii) ?0.1 wt. % and ?20.0 wt. % of a poly(siloxane-carbonate) block copolymer, with regard to the total weight of the polypropylene composition. The invention further relates to a process for preparing such polypropylene composition and to an article comprising the polypropylene composition.

Abstract: The disclosure concerns healable polycarbonate resins comprising at least about 5 mol % of disulfide units, articles comprising the healable polycarbonate resin, and methods of activating the healable polycarbonate resin by exposing the healable polycarbonate resin to heat or radiation.

Abstract: The present invention relates to a polymer composition comprising: (a) 54.0-79.0 wt % of a (meth)acrylic polymer; (b) 20.0-45.0 wt % of a copolymer comprising polymeric units according to formula (I) and polymeric units according to formula (II) and (c) 1.0-10.0 wt % of a copolymer comprising polymeric units according to formula (I) and polymeric units according to formula (III), wherein n=0 or 1; with regard to the total weight of the polymer composition. Such polymer composition provides a desired high heat resistance and good scratch resistance.

Abstract: The disclosure concerns healable polycarbonate resins comprising at least about 5 mol % of disulfide units, articles comprising the healable polycarbonate resin, and methods of activating the healable polycarbonate resin by exposing the healable polycarbonate resin to heat or radiation.

Abstract: The present invention presents a novel application of a wavelet-based multiscale method in a nanomachining process chemical mechanical planarization (CMP) of wafer fabrication. The invention involves identification of delamination defects of low-k dielectric layers by analyzing the nonstationary acoustic emission (AE) signal collected during copper damascene (Cu-low k) CMP processes. An offline strategy and a moving window-based strategy for online implementation of the wavelet monitoring approach are developed.

Abstract: The present invention is an online methodology for end point detection for use in a chemical mechanical planarization process which is both robust and inexpensive while overcoming some of the drawbacks of the existing end point detection approaches currently known in the art. The present invention provides a system and method for identifying a significant event in a chemical mechanical planarization process including the steps of decomposing coefficient of friction data acquired from a chemical mechanical planarization process using wavelet-based multiresolution analysis, and applying a sequential probability ratio test for variance on the decomposed data to identify a significant event in the chemical mechanical planarization process.

Abstract: The present invention presents a novel application of a wavelet-based multiscale method in a nanomachining process chemical mechanical planarization (CMP) of wafer fabrication. The invention involves identification of delamination defects of low-k dielectric layers by analyzing the nonstationary acoustic emission (AE) signal collected during copper damascene (Cu-low k) CMP processes. An offline strategy and a moving window-based strategy for online implementation of the wavelet monitoring approach are developed.