Patents by Inventor Aruna Kumar
Aruna Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250112160Abstract: Embodiments disclosed herein include an apparatus for bump translation. In an embodiment, the apparatus includes a substrate with a first bump field with a first height and a first depth on the substrate, where the first depth is orthogonal to the first height, and where the first bump field further comprises a first pitch in a direction of the first height. In an embodiment, the apparatus includes a second bump field with a second height and a second depth on the substrate, where the second depth is orthogonal to the second height, and where the second bump field comprises a second pitch in a direction of the second height, where the second pitch is smaller than the first pitch. Embodiments include a third bump field with a third height and the second depth, where a sum of the second height and the third height is equal to the first height.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Inventors: Andrew P. COLLINS, Jian Yong XIE, Aruna KUMAR, Rinkle JAIN, Basavaraj KANTHI
-
Publication number: 20250041933Abstract: The present invention relates to the process for enhancement of thermal conductivity property of aluminium up to 50 to 90% or more by doping graphene or reduced graphene of two to five layers into aluminium by melting and casting process under inert or vacuum or atmospheric condition using salt and flux. Graphene with purity of 70 to 90% was incorporated into aluminium of any form for 30 to 120 minutes under inert atmosphere or vacuum at 700-900 deg C. Graphene of 0.1 to 5% weight of the total weight of aluminium has been used in the process. Under optimum conditions enhancement of thermal conductivity up to 80 to 90% has been observed using this process.Type: ApplicationFiled: January 24, 2022Publication date: February 6, 2025Inventors: Saroj Kumar Nayak, Bijoy Kumar Satpathy, Kedar Bhojak, Arijit Mitra, Subrat Kar, Binuta Patra, Aruna Kumar Sahu
-
Patent number: 11535358Abstract: An aircraft windshield wiper system includes a wiper arm, a wiper blade coupled to a distal end of the wiper arm, and a drive shaft coupled to a proximal end of the wiper arm. The wiper blade is configured to clean water, dirt, and other debris from the windshield of the aircraft. The drive shaft is configured to rotate and cause the wiper arm with the coupled wiper blade to sweep across the windshield. The wiper arm includes both composite and metal components to reduce the weight of the windshield wiper system while also providing lightning strike protection.Type: GrantFiled: March 26, 2021Date of Patent: December 27, 2022Assignee: Rosemount Aerospace Inc.Inventors: Robin Jacob, Aruna Kumar Huluvangala Krishnappa, Guru Prasad Mahapatra
-
Publication number: 20220200780Abstract: A system comprising transmission circuitry to communicate first data to receiver circuitry over a serial communication link during an active state of the serial communication link; and power adjustment circuitry to adjust a power level of the transmission circuitry responsive to a request based on at least one margin measurement performed by the receiver circuitry on the first data, wherein the transmission circuitry is to communicate second data using the adjusted power level over the serial communication link.Type: ApplicationFiled: March 9, 2022Publication date: June 23, 2022Applicant: Intel CorporationInventors: Per E. Fornberg, Anoop Karunan, Aruna Kumar L S, Sunil Kumar CR, Sleiman Bou-Sleiman
-
Patent number: 11334512Abstract: Systems, methods, and apparatus managing access to a power management device are disclosed. A system has a primary integrated circuit and a power management integrated circuit. The primary integrated circuit has a communication controller configured to control access to a first serial bus for a plurality of subsystems in the primary integrated circuit. The power management integrated circuit is coupled to the first serial bus and to a second serial bus. An access control circuit in the power management integrated circuit is configured by the primary integrated circuit to control access to the power management integrated circuit through the second serial bus. The primary integrated circuit may be configured to write an access control configuration to the power management integrated circuit. The access control configuration may define write access rights for a secondary integrated circuit coupled to the power management integrated circuit through the second serial bus.Type: GrantFiled: February 12, 2021Date of Patent: May 17, 2022Assignee: QUALCOMM IncorporatedInventors: Aruna Kumar Tripathy, Uma Mahesh Revuri, Chris Rosolowski
-
Publication number: 20210403138Abstract: An aircraft windshield wiper system includes a wiper arm, a wiper blade coupled to a distal end of the wiper arm, and a drive shaft coupled to a proximal end of the wiper arm. The wiper blade is configured to clean water, dirt, and other debris from the windshield of the aircraft. The drive shaft is configured to rotate and cause the wiper arm with the coupled wiper blade to sweep across the windshield. The wiper arm includes both composite and metal components to reduce the weight of the windshield wiper system while also providing lightning strike protection.Type: ApplicationFiled: March 26, 2021Publication date: December 30, 2021Inventors: Robin Jacob, Aruna Kumar Huluvangala Krishnappa, Guru Prasad Mahapatra
-
Patent number: 11040765Abstract: A composite panel suitable for heating an environment includes a face sheet having a 3D woven structure and abutting the environment, and a first core layer positioned on a side of the face sheet opposite the environment. The 3D woven structure includes at least one z-fiber extending in a first direction, the first direction representing a thickness of the face sheet. The woven structure further includes a plurality of weft layers, each having a weft fiber extending in a second direction, and a warp layer disposed between the plurality of weft layers, the warp layer having a warp fiber extending in a third direction. The z-fiber extends along the plurality of weft layers across a full extent of the 3d woven structure in the first direction.Type: GrantFiled: September 19, 2018Date of Patent: June 22, 2021Assignee: Goodrich CorporationInventors: Aruna Kumar Huluvangala Krishnappa, Guru Prasad Mahapatra
-
Patent number: 10950198Abstract: Embodiments include systems, devices, and methods for a combination CPHY/DPHY/eDP display transmission PHY. A CDE can include a MIPI display serial interface (DSI) circuitry configured to receive 8 bit data compliant with a DSI protocol and output a differential pair signal to a PISO circuit. The same data path is configured for incoming eDP data, which can be routed to circuitry configured to receive 10 bit data compliant with an eDP protocol and output a differential pair signal to a PISO circuit. The system can include a CPHY circuitry that includes a mapper circuit to map a 16 bit input to a 21 bit output, mapper circuit having three 7 bit outputs, and CPHY logic to output a trio. The MUX coupled to an output of the PISO is configured to output one of the eDP or the DSI or the CPHY data to an display driver.Type: GrantFiled: July 5, 2017Date of Patent: March 16, 2021Assignee: Intel CorporationInventors: Aruna Kumar L S, Anoop Karunan, Sanjib Basu, Sunil Kumar C R
-
Patent number: 10943558Abstract: An integrated circuit is described. The integrated circuit includes a display controller having a driver. The display controller is configurable to select two or more display interfaces. The driver is designed to drive respective signals for the two or more display interfaces through a single output.Type: GrantFiled: June 30, 2016Date of Patent: March 9, 2021Assignee: Intel CorporationInventors: Aruna Kumar L. S., Sunil Kumar C. R., Sanjib Basu, Prakash K. Radhakrishnan
-
Patent number: 10932326Abstract: A flexible heated hose assembly for an aircraft is provided. The flexible heated hose assembly including: an inner fluid tube enclosing a fluid passageway, the inner fluid tube having tubular shape; a first silicone liner located radially outward from the inner fluid tube; and a printed positive temperature co-efficient (PTC) heater located radially outward from the first silicone liner.Type: GrantFiled: July 19, 2018Date of Patent: February 23, 2021Assignee: GOODRICH AEROSPACE SERVICES PRIVATE LIMITEDInventors: Raghavendra Hassan Venkataramu, Rhushikesh Patil, Gururaja Bambila, Aruna Kumar Huluvangala Krishnappa
-
Patent number: 10924305Abstract: Disclosed herein are devices and methods to facilitate compensating for intra-pair skew in a high-definition multimedia interface (HDMI) system. One or more skew training pattern may be transmitted on a signal line including a differential pair. Acknowledgment of receiving the skew training pattern may be received on a display data channel (DDC) associated with HDMI system. The skew training pattern may be used to ascertain and compensate for intra-pair skew.Type: GrantFiled: June 6, 2017Date of Patent: February 16, 2021Assignee: Intel CorporationInventors: Aruna Kumar, Anoop Karunan, Ganesh Balamurugan, Prakash Radhakrishnan
-
Publication number: 20200328915Abstract: Disclosed herein are devices and methods to facilitate compensating for intra-pair skew in a high-definition multimedia interface (HDMI) system. One or more skew training pattern may be transmitted on a signal line including a differential pair. Acknowledgment of receiving the skew training pattern may be received on a display data channel (DDC) associated with HDMI system. The skew training pattern may be used to ascertain and compensate for intra-pair skew.Type: ApplicationFiled: June 6, 2017Publication date: October 15, 2020Applicant: Intel CorporationInventors: Aruna KUMAR, Anoop KARUNAN, Ganesh BALAMURUGAN, Prakash RADHAKRISHNAN
-
Publication number: 20200189786Abstract: A water tank includes a compression molded tank shell. The tank shell includes a back panel and a side panel extending from the back panel. The side panel defines an outer perimeter of the water tank. A compression molded front panel is secured to the side panel to enclose an interior of the water tank. A method of forming a potable water tank includes forming a tank shell via a compression molding process, the tank shell including a back panel and a side panel extending from the back panel, the side panel defining an outer perimeter of the water tank. A front panel is separately formed by compression molding, and the front panel is secured to the side panel thereby enclosing an interior of the water tank.Type: ApplicationFiled: July 12, 2019Publication date: June 18, 2020Inventors: Aruna Kumar Huluvangala Krishnappa, Guru Prasad Mahapatra, Ravikumar Lachcha Nayak
-
Publication number: 20200001966Abstract: A composite panel suitable for heating an environment includes a face sheet having a 3D woven structure and abutting the environment, and a first core layer positioned on a side of the face sheet opposite the environment. The 3D woven structure includes at least one z-fiber extending in a first direction, the first direction representing a thickness of the face sheet. The woven structure further includes a plurality of weft layers, each having a weft fiber extending in a second direction, and a warp layer disposed between the plurality of weft layers, the warp layer having a warp fiber extending in a third direction. The z-fiber extends along the plurality of weft layers across a full extent of the 3d woven structure in the first direction.Type: ApplicationFiled: September 19, 2018Publication date: January 2, 2020Inventors: Aruna Kumar Huluvangala Krishnappa, Guru Prasad Mahapatra
-
Publication number: 20190364620Abstract: A flexible heated hose assembly for an aircraft is provided. The flexible heated hose assembly including: an inner fluid tube enclosing a fluid passageway, the inner fluid tube having tubular shape; a first silicone liner located radially outward from the inner fluid tube; and a printed positive temperature co-efficient (PTC) heater located radially outward from the first silicone liner.Type: ApplicationFiled: July 19, 2018Publication date: November 28, 2019Inventors: Raghavendra Hassan Venkataramu, Rhushikesh Patil, Gururaja Bambila, Aruna Kumar Huluvangala Krishnappa
-
Publication number: 20190012981Abstract: Embodiments include systems, devices, and methods for a combination CPHY/DPHY/eDP display transmission PHY. A CDE can include a MIPI display serial interface (DSI) circuitry configured to receive 8 bit data compliant with a DSI protocol and output a differential pair signal to a PISO circuit. The same data path is configured for incoming eDP data, which can be routed to circuitry configured to receive 10 bit data compliant with an eDP protocol and output a differential pair signal to a PISO circuit. The system can include a CPHY circuitry that includes a mapper circuit to map a 16 bit input to a 21 bit output, mapper circuit having three 7 bit outputs, and CPHY logic to output a trio. The MUX coupled to an output of the PISO is configured to output one of the eDP or the DSI or the CPHY data to an display driver.Type: ApplicationFiled: July 5, 2017Publication date: January 10, 2019Applicant: Intel CorporationInventors: Aruna Kumar L S, Anoop Karunan, Sanjib Basu, Sunil Kumar CR
-
Patent number: 9984654Abstract: A semiconductor chip is described. The semiconductor chip includes a display controller having a driver. The display controller is configurable to select a first, a second, a third and a fourth different display interface. The driver is designed to drive respective signals for each of the first, second, third and fourth interfaces through a single output.Type: GrantFiled: May 15, 2017Date of Patent: May 29, 2018Assignee: INTEL CORPORATIONInventors: Aruna Kumar, Prakash K. Radhakrishnan, Pravas Pradhan, Sunil Kumar C R, Vikas J
-
Patent number: 9977477Abstract: In an embodiment, processor includes at least one logic circuit to generate information to be output from the processor; an input/output (IO) interface circuit coupled to the at least one logic circuit to receive and transmit the information; a voltage regulator to provide an operating voltage to the IO interface circuit; and a controller to control the voltage regulator to provide the operating voltage at an adjusted level from a nominal operating voltage based on a process variation of at least a portion of a die including the IO interface circuit. Other embodiments are described and claimed.Type: GrantFiled: September 26, 2014Date of Patent: May 22, 2018Assignee: Intel CorporationInventors: Sunil Kumar C. R., Aruna Kumar, Prakash K. Radhakrishnan
-
Publication number: 20180005597Abstract: An integrated circuit is described. The integrated circuit includes a display controller having a driver. The display controller is configurable to select two or more display interfaces. The driver is designed to drive respective signals for the two or more display interfaces through a single output.Type: ApplicationFiled: June 30, 2016Publication date: January 4, 2018Inventors: Aruna Kumar, Sunil Kumar C.R., Sanjib Basu, Prakash K. Radhakrishnan
-
Publication number: 20170249922Abstract: A semiconductor chip is described. The semiconductor chip includes a display controller having a driver. The display controller is configurable to select a first, a second, a third and a fourth different display interface. The driver is designed to drive respective signals for each of the first, second, third and fourth interfaces through a single output.Type: ApplicationFiled: May 15, 2017Publication date: August 31, 2017Inventors: ARUNA KUMAR, PRAKASH K. RADHAKRISHNAN, PRAVAS PRADHAN, SUNIL KUMAR C. R., VIKAS J.