Abstract: An electronics equipment cabinet includes a plurality of walls defining a first space and a second space adjacent the first space. A wall of the plurality of walls separates the first space and the second space and includes an opening. The cabinet further includes a heat generating module having an inlet side, an outlet side opposing the inlet side, a heat generating component between the inlet side and the outlet side, and an internal fan for directing air heated by the heat generating component into the second space via the opening of the wall. One or more walls of the plurality of walls defining the second space includes a thermally conductive material for transferring heat from the second space to a surrounding environment external to the cabinet to reduce a temperature in the cabinet. Other example cabinets and methods for reducing temperature in cabinets are also disclosed.

Abstract: An example enclosure includes a top portion, a bottom portion, and at least one heat generating module adjacent the top portion of the enclosure. The heat generating module includes an inlet side, an outlet side, a heat generating component and an internal fan. The enclosure also includes a heat collector positioned adjacent the outlet side of the heat generating module to collect warm air from the outlet side of the heat generating module and divert the warm air to the bottom portion of the enclosure to mix with cooler air. The internal fan of the heat generating module draws the mixed air into the heat generating module to create an airflow loop within the enclosure to cool the heat generating component without a heat sink, a heat exchanger, or a fan external to the heat generating module. Other example enclosures and methods of managing heat inside enclosures are also disclosed.

Abstract: An example enclosure includes a top portion, a bottom portion, and at least one heat generating module adjacent the top portion of the enclosure. The heat generating module includes an inlet side, an outlet side, a heat generating component and an internal fan. The enclosure also includes a heat collector positioned adjacent the outlet side of the heat generating module to collect warm air from the outlet side of the heat generating module and divert the warm air to the bottom portion of the enclosure to mix with cooler air. The internal fan of the heat generating module draws the mixed air into the heat generating module to create an airflow loop within the enclosure to cool the heat generating component without a heat sink, a heat exchanger, or a fan external to the heat generating module. Other example enclosures and methods of managing heat inside enclosures are also disclosed.

Abstract: An electronics equipment cabinet includes a plurality of walls defining a first space and a second space adjacent the first space. A wall of the plurality of walls separates the first space and the second space and includes an opening. The cabinet further includes a heat generating module having an inlet side, an outlet side opposing the inlet side, a heat generating component between the inlet side and the outlet side, and an internal fan for directing air heated by the heat generating component into the second space via the opening of the wall. One or more walls of the plurality of walls defining the second space includes a thermally conductive material for transferring heat from the second space to a surrounding environment external to the cabinet to reduce a temperature in the cabinet. Other example cabinets and methods for reducing temperature in cabinets are also disclosed.