Patents by Inventor Arunkumar Madanagopal

Arunkumar Madanagopal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240025623
    Abstract: A temperature insulated packaging system includes a container having interior surface bounding an interior volume and a liner disposed within the interior volume and at least partially bounding a compartment configured to receive an item for temperature insulated shipping. The liner includes a first sleeve made of cellulose material and at least partially bounds a channel. The first sleeve has an outside wall disposed adjacent to the container and an opposing inside wall disposed adjacent to the compartment configured to receive the item for shipping, the channel being disposed between the inside wall and the outside wall. At least one insulation sheet is disposed within the channel of the first sleeve, the at least one insulation sheet being made of a cellulose material and having a plurality of recesses formed thereon.
    Type: Application
    Filed: August 10, 2023
    Publication date: January 25, 2024
    Inventors: Arunkumar MADANAGOPAL, Eric BARNITZ
  • Publication number: 20230322471
    Abstract: The present disclosure relates to temperature insulated packaging systems and related methods of manufacture and use that can be used for shipping perishable materials. An insulative insert is formed by folding one or more pieces of stock cellulose material along predetermined fold lines and folding slots to form an insert in a folded configuration suitable for insertion as an insulative liner within a container for use in shipment.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 12, 2023
    Inventors: Arunkumar MADANAGOPAL, Kenneth ORELLANA, Paulius ADOMELIS
  • Patent number: 11760555
    Abstract: A temperature insulated packaging system includes a container having interior surface bounding an interior volume and a liner disposed within the interior volume and at least partially bounding a compartment configured to receive an item for temperature insulated shipping. The liner includes a first sleeve made of cellulose material and at least partially bounds a channel. The first sleeve has an outside wall disposed adjacent to the container and an opposing inside wall disposed adjacent to the compartment configured to receive the item for shipping, the channel being disposed between the inside wall and the outside wall. At least one insulation sheet is disposed within the channel of the first sleeve, the at least one insulation sheet being made of a cellulose material and having a plurality of recesses formed thereon.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: September 19, 2023
    Assignee: Life Technologies Corporation
    Inventors: Arunkumar Madanagopal, Eric Barnitz
  • Publication number: 20230117239
    Abstract: A temperature insulated packaging system includes a container having interior surface bounding an interior volume and a liner disposed within the interior volume and at least partially bounding a compartment configured to receive an item for temperature insulated shipping. The liner includes a first sleeve made of cellulose material and at least partially bounds a channel. The first sleeve has an outside wall disposed adjacent to the container and an opposing inside wall disposed adjacent to the compartment configured to receive the item for shipping, the channel being disposed between the inside wall and the outside wall. At least one insulation sheet is disposed within the channel of the first sleeve, the at least one insulation sheet being made of a cellulose material and having a plurality of recesses formed thereon.
    Type: Application
    Filed: October 27, 2022
    Publication date: April 20, 2023
    Inventors: Arunkumar MADANAGOPAL, Eric BARNITZ
  • Patent number: 11511927
    Abstract: A temperature insulated packaging system includes a container having interior surface bounding an interior volume and a liner disposed within the interior volume and at least partially bounding a compartment configured to receive an item for temperature insulated shipping. The liner includes a first sleeve made of cellulose material and at least partially bounds a channel. The first sleeve has an outside wall disposed adjacent to the container and an opposing inside wall disposed adjacent to the compartment configured to receive the item for shipping, the channel being disposed between the inside wall and the outside wall. At least one insulation sheet is disposed within the channel of the first sleeve, the at least one insulation sheet being made of a cellulose material and having a plurality of recesses formed thereon.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: November 29, 2022
    Inventors: Arunkumar Madanagopal, Eric Barnitz
  • Publication number: 20210253330
    Abstract: A temperature insulated packaging system includes a container having interior surface bounding an interior volume and a liner disposed within the interior volume and at least partially bounding a compartment configured to receive an item for temperature insulated shipping. The liner includes a first sleeve made of cellulose material and at least partially bounds a channel. The first sleeve has an outside wall disposed adjacent to the container and an opposing inside wall disposed adjacent to the compartment configured to receive the item for shipping, the channel being disposed between the inside wall and the outside wall. At least one insulation sheet is disposed within the channel of the first sleeve, the at least one insulation sheet being made of a cellulose material and having a plurality of recesses formed thereon.
    Type: Application
    Filed: April 30, 2021
    Publication date: August 19, 2021
    Inventors: Arunkumar MADANAGOPAL, Eric BARNITZ
  • Patent number: 8863420
    Abstract: A three-dimensional supporting frame includes a blank. The blank includes an image receiving surface, a back surface opposed to the image receiving surface, a center portion defining a perimeter, and at least three foldable extensions extending from the perimeter. Each of the foldable extensions includes no less than four folds to be folded toward the back surface to form the three-dimensional supporting frame. A tab line is scored in one of the folds of each of the at least three foldable extensions, the tab line to be released to form a tab to be secured to the back surface when the folds are folded. An adhesion promoting layer is present on the back surface at the center portion.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: October 21, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Edmondson, Arunkumar Madanagopal, Francois K Pirayesh, Xiaoqi Zhou
  • Publication number: 20130270128
    Abstract: Described herein is a package assembly for stacks of imaging material. The packaging assembly comprises a master carton that retains stacks of imaging material and a separation access band. The separation access band separates the stacks from one another within the master carton.
    Type: Application
    Filed: April 16, 2012
    Publication date: October 17, 2013
    Inventors: Morad M Samii, Arunkumar Madanagopal
  • Publication number: 20130219761
    Abstract: A three-dimensional supporting frame includes a blank. The blank includes an image receiving surface, a back surface opposed to the image receiving surface, a center portion defining a perimeter, and at least three foldable extensions extending from the perimeter. Each of the foldable extensions includes no less than four folds to be folded toward the back surface to form the three-dimensional supporting frame. A tab line is scored in one of the folds of each of the at least three foldable extensions, the tab line to be released to form a tab to be secured to the back surface when the folds are folded. An adhesion promoting layer is present on the back surface at the center portion.
    Type: Application
    Filed: February 24, 2012
    Publication date: August 29, 2013
    Inventors: David Edmondson, Arunkumar Madanagopal, Francois K. Pirayesh, Xiaoqi Zhou
  • Patent number: D640870
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: July 5, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Regan, Arunkumar Madanagopal, Erin Parker Simon
  • Patent number: D677935
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: March 19, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Francois K Pirayesh, Xiaoqi Zhou, Arunkumar Madanagopal
  • Patent number: D677936
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: March 19, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Francois K Pirayesh, Xiaoqi Zhou, Arunkumar Madanagopal
  • Patent number: D710631
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: August 12, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Francois K. Pirayesh, Xiaoqi Zhou, Arunkumar Madanagopal