Patents by Inventor Arunkumar Shamrao Watwe

Arunkumar Shamrao Watwe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond coating powder comprising MCrAlY (M=Ni,Fe,Co), method of making, and a method of applying as bond coating
    Patent number: 8999514
    Abstract: Provided is bond coating powder and method of making. The method includes providing a powder including a plurality of parent particles. The method includes providing a plurality of dispersoids. The method includes mechanically alloying the powder and the plurality of dispersoids at ambient temperature. The mechanical alloying operable to provide a selective occupation of the plurality of dispersoids in a grain boundary area of the plurality of parent particles providing the bond coating powder. The plurality of dispersoids occupy about 18 percent to about 30 percent of the grain boundary area of the bond coating powder.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: April 7, 2015
    Assignee: General Electric Company
    Inventors: Arunkumar Shamrao Watwe, Yuk-Chiu Lau
  • BOND COATING POWDER, METHOD OF MAKING, AND A METHOD OF APPLYING AS BOND COATING
    Publication number: 20130202792
    Abstract: Provided is bond coating powder and method of making. The method includes providing a powder including a plurality of parent particles. The method includes providing a plurality of dispersoids. The method includes mechanically alloying the powder and the plurality of dispersoids at ambient temperature. The mechanical alloying operable to provide a selective occupation of the plurality of dispersoids in a grain boundary area of the plurality of parent particles providing the bond coating powder. The plurality of dispersoids occupy about 18 percent to about 30 percent of the grain boundary area of the bond coating powder.
    Type: Application
    Filed: February 3, 2012
    Publication date: August 8, 2013
    Applicant: General Electric Company
    Inventors: Arunkumar Shamrao WATWE, Yuk-Chiu Lau
  • Composite materials comprising a hard ceramic phase and a Cu-Ni-Sn alloy
    Patent number: 8349466
    Abstract: Composite materials comprising a hard ceramic phase and an infiltration alloy are disclosed. The hard ceramic phase may comprise a carbide such as tungsten carbide and/or cast carbide. The infiltration alloy is Cu-based and comprises Ni and Sn. The infiltration alloy may further include Nb, and may be substantially free of Mn. The composite material may be heat treated in order to improve its mechanical properties. For example, the composition of the Cu—Ni—Sn infiltration alloy may be selected such that its hardness, wear resistance, toughness and/or transverse rupture strength are improved after the composite material is solutioned and aged at elevated temperatures.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: January 8, 2013
    Assignee: Kennametal Inc.
    Inventors: Arunkumar Shamrao Watwe, Harold E. Kelley
  • Composite materials comprising a hard ceramic phase and a Cu-Ni-Sn alloy
    Publication number: 20080202719
    Abstract: Composite materials comprising a hard ceramic phase and an infiltration alloy are disclosed. The hard ceramic phase may comprise a carbide such as tungsten carbide and/or cast carbide. The infiltration alloy is Cu-based and comprises Ni and Sn. The infiltration alloy may further include Nb, and may be substantially free of Mn. The composite material may be heat treated in order to improve its mechanical properties. For example, the composition of the Cu—Ni—Sn infiltration alloy may be selected such that its hardness, wear resistance, toughness and/or transverse rupture strength are improved after the composite material is solutioned and aged at elevated temperatures.
    Type: Application
    Filed: February 22, 2007
    Publication date: August 28, 2008
    Applicant: Kennametal Inc.
    Inventors: Arunkumar Shamrao Watwe, Harold E. Kelley