Patents by Inventor Arvind Bagde

Arvind Bagde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12560526
    Abstract: Described herein relates to a system of and method for assessing adhesion properties of an adhesion component of at least one Transdermal Delivery System (hereinafter “TDS”) product using a skin-correlated probe. The present disclosure may comprise a skin-correlated probe configured to mimic a surface energy of human skin. Additionally, the skin-correlated probe of the system may be fabricated using additive manufacturing and/or additive layer manufacturing. Accordingly, the skin-correlated probe of the system may substantially decrease the adhesive force required to unbind the adhesive from the skin-correlated probe as compared to an industrial standard stainless steel probe. In addition, the system may be configured to be used for the in vitro in vivo correlation of the at least one TDS product.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: February 24, 2026
    Assignee: Florida A&M University
    Inventors: Mandip Sachdeva, Satyanarayan Dev, Nisarg Modi, Arvind Bagde, Keb Mosley-Kellum
  • Patent number: 12233043
    Abstract: A composition, method of treating inflammation or edema, and method of increasing transdermal permeation and flux of at least one cannabinoid is presented. The composition is comprised of at least one cannabinoid, at least one permeation enhancer and at least one hydrophilic polymer. Administration of a therapeutically effective amount of this composition of can be used to treat both inflammation and edema in a patient as well as increasing transdermal permeation and flux of the at least one cannabinoid.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: February 25, 2025
    Assignee: Florida A&M University
    Inventors: Mandip Sachdeva, Arvind Bagde, Oluwasevi Salau
  • Patent number: 12179429
    Abstract: Described herein relates to a multi-component adaptor assembly including a resin reservoir adaptor disposed on a printing surface of a preexisting additive manufacturing device, and including a build platform adaptor secured to a translatable arm of the preexisting additive manufacturing device. The resin reservoir adaptor is used to modify an existing resin reservoir by creating one or more smaller reservoirs within the larger housing, thereby reducing an amount of resin stored within the device to reduce resin waste. Moreover, the rotating and/or sliding build platform adaptor is designed to selectively contact one or more of the reservoirs of the resin reservoir adaptor, thereby selectively printing components of an additive manufactured process.
    Type: Grant
    Filed: October 31, 2023
    Date of Patent: December 31, 2024
    Assignee: Florida A&M University
    Inventors: Mandip Sachdeva, Arvind Bagde, Keb Mosley-Kellum, Satyanarayan Dev, Thanh Dinh
  • Patent number: 11911501
    Abstract: A biocompatible resin composition that is used in the manufacture of a dissolvable microneedle that is used for the transdermal delivery of one or more active pharmaceutical ingredients to a subject. The biocompatible resin composition includes lithium phenyl-2,4,6-trimethylbenzoylphospinate, water, and poly(ethylene glycol) diacrylate (molecular weight 550), and may include methacrylated hyaluronic acid, that is capable of forming a structurally stable microneedle patch. The microneedle patch is formulated with the biocompatible resin composition using a continuous, one-step process utilizing additive manufacturing. Once manufactured, the microneedle patches are formulated to adhere to an outer layer of a subject's skin. Once administered to the subject, the microneedle compositions create microscopic pathways into the subject's subdermal layers to deliver one or more active agents to the subject, such as to the subject's bloodstream.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: February 27, 2024
    Assignee: Florida A&M University
    Inventors: Mandip Sachdeva, Arvind Bagde, Satyanarayan Dev
  • Patent number: 11806930
    Abstract: A multi-component adaptor assembly including a resin reservoir adaptor disposed on a printing surface of a preexisting additive manufacturing device, and including a build platform adaptor secured to a translatable arm of the preexisting additive manufacturing device. The resin reservoir adaptor is used to modify an existing resin reservoir by creating one or more smaller reservoirs within the larger housing, thereby reducing an amount of resin stored within the device to reduce resin waste. Moreover, the rotating and/or sliding build platform adaptor is designed to selectively contact one or more of the reservoirs of the resin reservoir adaptor, thereby selectively printing components of an additive manufactured process. The multi-component adaptor assembly allows for additive manufacturing projects using less resin with fewer waste products; simultaneous printing of identical structures; and the selective printing of different components of a structure during a single printing cycle.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: November 7, 2023
    Assignee: Florida A&M University
    Inventors: Mandip Sachdeva, Arvind Bagde, Keb Mosley-Kellum, Satyanarayan Dev, Thanh Dinh
  • Patent number: 11135176
    Abstract: A continuous process for preparing a solid lipid nanoparticle of ibuprofen utilizing hot melt extrusion which avoids additional steps such as high-pressure homogenization, ultrasonication, or solvent evaporation. The continuous process includes preparing a pre-emulsion comprising a lipid, and continuously processing the pre-emulsion through a hot melt extruder device.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: October 5, 2021
    Assignee: Florida A&M University
    Inventors: Mandip Sachdeva, Arvind Bagde, Ketankumar Patel