Patents by Inventor Arvind Hanumantharayappa

Arvind Hanumantharayappa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-PITCH BALL GRID ARRAY
    Publication number: 20230245964
    Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Inventors: Granthana Kattehalli Rangaswamy, Arvind Hanumantharayappa, Srinivas Venkataraman
  • Multi-pitch ball grid array
    Patent number: 11652035
    Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: May 16, 2023
    Assignee: Juniper Networks, Inc.
    Inventors: Granthana Kattehalli Rangaswamy, Arvind Hanumantharayappa, Srinivas Venkataraman
  • MULTI-PITCH BALL GRID ARRAY
    Publication number: 20210057319
    Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.
    Type: Application
    Filed: November 4, 2020
    Publication date: February 25, 2021
    Inventors: Granthana Kattehalli Rangaswamy, Arvind Hanumantharayappa, Srinivas Venkataraman
  • Multi-pitch ball grid array
    Patent number: 10840173
    Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a. BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch PT. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: November 17, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Granthana Kattehalli Rangaswamy, Arvind Hanumantharayappa, Srinivas Venkataraman
  • MULTI-PITCH BALL GRID ARRAY
    Publication number: 20200105650
    Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a. BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch PT. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, K wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Granthana Kattehalli Rangaswamy, Arvind Hanumantharayappa, Srinivas Venkataraman