Abstract: An apparatus includes a heat sink and a resonance tube in a computing device extending from a fan and past the heat sink and past a component of the computing device. The resonance tube is thermally coupled to the heat sink and to the component. The apparatus includes a driver connected at an end of the resonance tube adjacent to the fan. Sound from the fan moves the driver to induce sound waves within the resonance tube. A length of the resonance tube is selected to correspond to a fan sound frequency of sound emanating from the fan where sound waves at the frequency resonate within the resonance tube at the fan sound frequency. Heat from the component is transferred to the resonance tube and travels in the resonance tube to a location where the heat sink is coupled to the resonance tube and exits to the heat sink.

Abstract: An apparatus with computing device cooling system with a replaceable pump assembly includes a pump assembly configured to connect to a cooling system within a rack-mountable computing device. The rack-mountable computing device includes a plurality of data processing devices within the rack-mountable computing device. The plurality of data processing devices are cooled by cooling fluid from the cooling system. The apparatus includes two or more pumps mounted to the pump assembly, a fluid inlet connector, a fluid outlet connector, and a fluid channel extending from the fluid inlet connector, through each of the two or more pumps in a series connection, and to the fluid outlet connector.

Abstract: Methods, systems, and apparatus for installing a TIM installation device include positioning, on a computer component, a carrier comprising multiple cutouts, where multiple TIMs are positioned on the carrier over the multiple cutouts, positioning a heat sink on the carrier, where the carrier is positioned between the computer component and the heat sink, and coupling the heat sink to the computer component, including compressing the multiple TIMs into the multiple cutouts to be in thermal contact with both the heat sink and the computer component.

Abstract: Detecting coolant leaks in a server system including receiving, by a controller in the server system with nodes stacked vertically, a voltage fault alert from a first node; receiving, by the controller in the server system with nodes stacked vertically, a voltage fault alert from a second node located below the first node; and upon receiving the voltage fault alert from the first node and the voltage fault alert from the second node, powering down, by the controller, one or more nodes located below the second node.

Abstract: Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component are disclosed. According to an aspect, a cooling system includes a conduit configured to be in conductive heat transfer interface with an electronic component. The conduit is configured to transfer a first portion of heat from the electronic component to a flow of a cooling liquid. The heat transfer device is also configured to be in conductive heat transfer interface with the electronic component, and to transfer a second portion of heat from the electronic component. The cooling system includes a heat collector manifold configured to receive the flow of the cooling liquid with the first portion of heat from the conduit, to receive the second portion of heat via conductive heat transfer from the heat transfer device, and to transfer the second portion of heat to the flow of the cooling liquid.

Abstract: Cooling systems having cooling and augmentation loops for electronic components and related methods are disclosed. According to an aspect, a cooling system for an electronic component includes a cooling loop in thermal transfer interface with a first electronic component. The cooling loop is configured to contain a first flow of a cooling liquid between an inlet and an outlet. The cooling system also includes at least one augmentation loop configured to contain a second flow of the cooling liquid and alternately engage and disengage with respect to the cooling loop, such that engaging the augmentation loop to the cooling loop converts a series flow pattern with the first flow of the cooling liquid into a parallel flow pattern of a portion of the first flow of the cooling liquid with the second flow of the cooling liquid, without disconnection of the cooling loop from the inlet and outlet.

Abstract: Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component are disclosed. According to an aspect, a cooling system includes a conduit configured to be in conductive heat transfer interface with an electronic component. The conduit is configured to transfer a first portion of heat from the electronic component to a flow of a cooling liquid. The heat transfer device is also configured to be in conductive heat transfer interface with the electronic component, and to transfer a second portion of heat from the electronic component. The cooling system includes a heat collector manifold configured to receive the flow of the cooling liquid with the first portion of heat from the conduit, to receive the second portion of heat via conductive heat transfer from the heat transfer device, and to transfer the second portion of heat to the flow of the cooling liquid.

Abstract: Targeted cooling in a liquid cooling system including detecting, for a node cooled by the liquid cooling system, a condition indicating increased heating, wherein the liquid cooling system includes a primary pump and a node-specific pump positioned in a loop of the liquid cooling system between the primary pump and the node; and responsive to detection of the condition, increasing cooling to the node by increasing liquid flow rate at the node-specific pump positioned in the loop of the liquid cooling system between the primary pump and the node, thereby achieving a higher temperature differential between an inlet and an outlet line and increased waste heat recovery.

Abstract: An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

Abstract: An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

Abstract: Detecting coolant leaks in a server system including receiving, by a controller in the server system with nodes stacked vertically, a voltage fault alert from a first node; receiving, by the controller in the server system with nodes stacked vertically, a voltage fault alert from a second node located below the first node; and upon receiving the voltage fault alert from the first node and the voltage fault alert from the second node, powering down, by the controller, one or more nodes located below the second node.