Patents by Inventor Arvind Narayanaswamy

Arvind Narayanaswamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11163663
    Abstract: A method for improving end user experience in a virtual desktop infrastructure that includes a plurality of user devices is provided. The method includes receiving data that relates to respective resource usage by each of the user devices, calculating and monitoring metrics that are based on the resource usage data, analyzing the metrics to determine a system performance problem, and generating an alert message that notifies appropriate personnel about the problem diagnosis. The virtual desktop infrastructure may include more than one thousand devices, and as a result, the problem diagnosis may be useful for predicting and preventing a subsequent occurrence of the problem in many devices for which the problem has not yet become manifested.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 2, 2021
    Assignee: JPMORGAN CHASE BANK, N.A.
    Inventors: Suresh Chellappan, Arvind Narayanaswamy, Cal Payne
  • Publication number: 20200327034
    Abstract: A method for improving end user experience in a virtual desktop infrastructure that includes a plurality of user devices is provided. The method includes receiving data that relates to respective resource usage by each of the user devices, calculating and monitoring metrics that are based on the resource usage data, analyzing the metrics to determine a system performance problem, and generating an alert message that notifies appropriate personnel about the problem diagnosis. The virtual desktop infrastructure may include more than one thousand devices, and as a result, the problem diagnosis may be useful for predicting and preventing a subsequent occurrence of the problem in many devices for which the problem has not yet become manifested.
    Type: Application
    Filed: April 8, 2020
    Publication date: October 15, 2020
    Applicant: JPMorgan Chase Bank, N.A.
    Inventors: Suresh CHELLAPPAN, Arvind NARAYANASWAMY, Cal PAYNE
  • Publication number: 20190055846
    Abstract: Thermal-barrier coatings for protecting a substrate from heat include a nitride layer, with the nitride layer including an interstitial nitride of a transition metal. In some embodiments, the nitride layer may include, for example, titanium nitride, niobium nitride, hafnium nitride, vanadium nitride, or zirconium nitride. The implementations further include a method comprising providing a substrate for use in assembling structures (e.g., a turbine blade) configured to be exposed to high temperature conditions, and applying a coating to the substrate, with the coating comprising a nitride layer, and with the nitride layer comprising transition-metal nitride.
    Type: Application
    Filed: August 16, 2018
    Publication date: February 21, 2019
    Inventor: Arvind Narayanaswamy
  • Patent number: 7508110
    Abstract: A surface-plasmon-coupled thermoelectric apparatus includes a first surface-plasmon substrate and a thermoelectric substrate electrically coupled to a plurality of electrodes. The substrates are electrically isolated from each other, and a first face of the thermoelectric substrate opposes a first face of the first surface-plasmon substrate to define a phonon insulating gap. A method of transferring thermal energy across the phonon insulating gap includes creating a first surface-plasmon polariton at the first surface-plasmon substrate when the first surface-plasmon substrate is coupled to a first thermal reservoir. Also included is creating a nonequilibrium state between the electron temperature and the phonon temperature at a first face of the thermoelectric substrate, when a second face of the thermoelectric substrate is coupled to a second thermal reservoir.
    Type: Grant
    Filed: December 8, 2004
    Date of Patent: March 24, 2009
    Assignee: Massachusetts Institute of Technology
    Inventors: Gang Chen, Ronggui Yang, Arvind Narayanaswamy
  • Publication number: 20050247337
    Abstract: A surface-plasmon-coupled thermoelectric apparatus includes a first surface-plasmon substrate and a thermoelectric substrate electrically coupled to a plurality of electrodes. The substrates are electrically isolated from each other, and a first face of the thermoelectric substrate opposes a first face of the first surface-plasmon substrate to define a phonon insulating gap. A method of transferring thermal energy across the phonon insulating gap includes creating a first surface-plasmon polariton at the first surface-plasmon substrate when the first surface-plasmon substrate is coupled to a first thermal reservoir. Also included is creating a nonequilibrium state between the electron temperature and the phonon temperature at a first face of the thermoelectric substrate, when a second face of the thermoelectric substrate is coupled to a second thermal reservoir.
    Type: Application
    Filed: December 8, 2004
    Publication date: November 10, 2005
    Applicant: Massachusetts Institute of Technology
    Inventors: Gang Chen, Ronggui Yang, Arvind Narayanaswamy